Electronics Forum | Mon Sep 28 09:35:28 EDT 1998 | Clive Heke
I have had some field failures returned recently, the boards had flux contamination under the components in a sensitive area, Nothing really visible until the component was removed, and the board had no evidence of rework of any type. Is it possib
Electronics Forum | Thu Mar 29 15:50:35 EST 2001 | tomgervascio
We've think that with seen solder shorts under BGAs after wave soldering the boards. In addition, it seems to be related to a certain soldermask configuration over the topside BGA vias.. THere is one vendor,A, that is applying soldermask after HASL,
Electronics Forum | Tue Dec 14 22:17:33 EST 1999 | Dave F
Armin: How ya doin� bud? CK gives good advice, but I'd like to take a bit of a different angle. Q1. For 0.7 mm (0.027in) diameter hole for vias, what�s the minimum annular ring for this hole diameter? Depends on what you�re trying to do. For in
Electronics Forum | Mon Sep 28 19:07:47 EDT 1998 | Steve Gregory
| I have had some field failures returned recently, the boards had flux contamination under the components in a sensitive area, Nothing really visible until the component was removed, and the board had no evidence of rework of any type. Is it poss
Electronics Forum | Tue Jul 15 16:12:23 EDT 2008 | boardhouse
Hi Armynski, I sell for an offshore board house, yes, it is common for offshore board shops to fill vias. The bubble is caused by air entrampment within the hole it self, when heat is applied during Hot air and the via is covered on both sides the e
Electronics Forum | Thu Feb 07 20:53:51 EST 2002 | davef
Regardless of the technique used for the mounting pad shape or definition, isolation of the plated through hole [PTH] from the mounting pad is important. If the PTH is contained within the mounting pad, solder will wick down the PTH. The amount of
Electronics Forum | Thu Oct 01 11:40:17 EDT 1998 | Justin Medernach
Are there anyone who can give me the answer about solder ball problem? | We have 12 layer PCB and double sided PCB. After one side reflow soldering We found lots of solder ball under the PCB. The solder ball was coming out from via hole. | So
Electronics Forum | Sat Aug 21 02:16:42 EDT 2010 | isd_jwendell
I do not have a QSP-2, but build boards where others have done the layout. Some have not included fiducials, and I am left finding other things. Some boards have complete tenting over the vias, so not all PTH pads will work. Drill holes are not as ac
Electronics Forum | Tue Sep 22 09:07:02 EDT 1998 | Steve Gregory
Hi Jacqueline! Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? If that is true, are there many vias concentrated aroun
Electronics Forum | Mon Dec 13 00:48:33 EST 1999 | armin
Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? What�s the term unsupported and supported holes refer to in IPC-2221 9.1.2 Annular Ring Requirements? I have a proto-type PCB (designed by our R&
