New Equipment | Solder Paste Stencils
Through the increase of mixed technologies, stepped stencils have gained importance to the electronic assembly manufacturer. If the solder paste quantity can no longer be adequately regulated by adjusting Step/Relief Stencil Picture the pad sizes, st
Electronics Forum | Sat Sep 14 01:34:19 EDT 2002 | Yngwie
I have the following questions on Via in Pad and want to understand each of them wrt : - complete Via in pad - partial encroachment - via partially in pad 1) What is the general feel for via in pad for upcoming designs? 2) What are the manufacturi
Electronics Forum | Wed Feb 27 19:55:13 EST 2002 | nifhail
Hi, I need help to understand further on the via in pad for 0402 requirement. If I were to do the DFM over the brd design which consist of 0402 with via on pad, what is the criteria that I should look for ? I learned that the via in pad does not wor
Industry News | 2019-09-18 16:03:56.0
IPC offers a day-long technical education seminar, Design for Excellence (DFX): DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly), in conjunction with PCB Carolina November 12, Raleigh, N.C., at the McKimmon Conference and Training Center.
Industry News | 2022-11-22 06:14:08.0
Full-auto SMT Stencil Printer is indispensable equipment in SMT production Line. It is generally composed of board mounting, solder paste, imprinting, and circuit board transfer. Widely used are Full-auto SMT Stencil Printer and semi-auto SMT Stencil Printer These two types, next, let's share with you the operating instructions of Full-auto SMT Stencil Printer.
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Parts & Supplies | SMT Equipment
Panasonic smt nozzles models: Panasonic MSR SMT NOZZLE Part Number Description 10468S0002 MSR - SMT NOZZLE - VVS (0.84 X 0.60) 10468S0003 - NZ. - VS (1.0 X 0.64) 10468S0004 -NZ. - S (1.6 X 1.06) 1046710134 -NZ. - M (1.60mm) 10467S0001 -NZ. - L
Parts & Supplies | SMT Equipment
Panasonic smt nozzles models: Panasonic MSR SMT NOZZLE Part Number Description 10468S0002 MSR - SMT NOZZLE - VVS (0.84 X 0.60) 10468S0003 - NZ. - VS (1.0 X 0.64) 10468S0004 -NZ. - S (1.6 X 1.06) 1046710134 -NZ. - M (1.60mm) 10467S0001 -NZ. - L
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
Teaching video on PCB through hole repair. BEST instructors teach the method for repair of a damaged eyelet using a multitude of different close up and angled views. Repair is completed per the IPC 7721 instructions. http://www.solder.net
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/products/plasma-treatment-systems/via-high-volume-series
. The VIA series plasma treatment systems utilize a patented plasma technology to produce superior uniformity at high throughputs. The VIA series for large-panel plasma processing is available in various chamber sizes, with choice of vertical or horizontal panel configurations
ORION Industries | http://orionindustries.com/pdfs/silpadk10.pdf
OR THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer. Sil-Pad K-10 (SP K-10
