Electronics Forum: via in pad plated over solder lift (12)

Re: Via in the middle of a pad

Electronics Forum | Wed Jan 05 12:48:44 EST 2000 | Dave F

Millerin: You are generally correct about plugging and over plating vias, but in Michaels case, the via is blind. Plugging would trap air between the bottom of the via and the plug material, causing an air pocket. When heated to soldering temperat

Re: Reg: Voids in solder bumps

Electronics Forum | Thu Oct 08 14:04:04 EDT 1998 | Kris Ewen

Manish, I've seen similar phenomenon when processing CSPs on our cards. In our case, we were placing the components over the opening to in-pad blind vias. Due to poor drilling and plating processes by our board suppliers, volatiles were outgassing

Industry News: via in pad plated over solder lift (1)

Why use Via in Pad Design?

Industry News | 2019-11-05 22:08:21.0

Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.

Headpcb

Express Newsletter: via in pad plated over solder lift (1050)

SMT Express, Issue No. 2 - from SMTnet.com

SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Continued From Previous Page PRINTED CIRCUIT BOARD FABRICATION BASICS AN OUTLINE Earl Moon Proof Of Design (POD) 8. PLATING (AND

Partner Websites: via in pad plated over solder lift (32)

Ask Questions | EPTAC

| https://www.eptac.com/ask/

making acceptable solder connections using the vapor phase process. Can you tell me if there are any specific issues related to vapor phase soldering to immersion tin plated pads on relatively thick multilayer PCBs? Read Answer Bubbles in Conformal Coating

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

-3 Via-In-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and Storage Hardware Matt Kelly, Mark Jeanson, Timothy Younger, Jim Bielick, Theron Lewis, Mitch Ferrill Abstract 30-2 A Nanocopper Based Alternative to

Surface Mount Technology Association (SMTA)


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