Industry News | 2010-11-09 10:15:49.0
With IPC-4761 as its guide, PCB Manufacturer sheds light on Via Plugging from the fabrication perspective.
Technical Library | 2014-11-13 19:23:50.0
With increasing power loss of electrical components, thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advances in semiconductor technology, particularly in the regime of high-power components, the temperature dependence of the long-term reliability is a critical parameter and has to be considered with highest possible care during the design phase (...) The aim of this paper is to give a short overview about standard thermal solutions like thick copper, thermal vias, plugged vias or metal core based PCBs. Furthermore, attention will be turned on the development of copper filled thermal vias in thin board constructions...
Technical Library | 2021-05-26 00:53:26.0
This paper describes a copper electroplating enabling technology for filling microvias. Driven by the need for faster, smaller and higher performance communication and electronic devices, build-up technology incorporating microvias has emerged as a viable multilayer printed circuit manufacturing technology. Increased wiring density, reduced line widths, smaller through-holes and microvias are all attributes of these High Density Interconnect (HDI) packages. Filling the microvias with conductive material allows the use of stacked vias and via in pad designs thereby facilitating additional packaging density. Other potential design attributes include thermal management enhancement and benefits for high frequency circuitry. Electrodeposited copper can be utilized for filling microvias and provides potential advantages over alternative via plugging techniques. The features, development, scale up and results of direct current (DC) and periodic pulse reverse (PPR) acid copper via filling processes, including chemistry and equipment, are described.
Industry Directory | Manufacturer
Manufacturer of flex, rigid-flex, and rigid circuit boards. We offer prototype and production delivery options. We manufacture commercial, military, medical and industrial jobs and offer value added services such as assembly. We can customize services to fit your needs, such as gold or white tin plating, plugged or blind vias, etc.
Industry Directory | Manufacturer
PCB Repairs of all kinds including-Solder on Tab (Solder Removal, Gold Plating), PTH & Delam repairs, etc.
Industry Directory | Consultant / Service Provider / Manufacturer
Pandawill Circuits manufacture and supply a wide range of high quality PCB technologies, volumes, cost and manufacturing lead-time options based on our fundamental understanding of the PCB manufacture
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 8350B The totally programmable features and internal memory of the 8350B Sweep Oscillator Mainframe can speed up your repetitious testing needs. A push of a button returns the unit to local control for bench work. Sweep frequency
New Equipment | Fabrication Services
Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 4mils Copper thickness: 0.5oz Special process : 0.25MM BGA , resin plugged vias in BGA pads
Industry News | 2010-09-08 11:49:17.0
PCB Fabricator Installs MASS VHF 300 VS for Via Hole Filling Addressing the continuous demands pertaining to via hole filling, through holes and blind vias
Industry News | 2010-06-29 11:33:33.0
Agilent Technologies’ interest in boundary scan test support grows with its second JTAG test systems move in a month.
.png)
