Industry Directory | Manufacturer
Manufacturer of flex, rigid-flex, and rigid circuit boards. We offer prototype and production delivery options. We manufacture commercial, military, medical and industrial jobs and offer value added services such as assembly. We can customize services to fit your needs, such as gold or white tin plating, plugged or blind vias, etc.
Industry Directory | Manufacturer
PCB Repairs of all kinds including-Solder on Tab (Solder Removal, Gold Plating), PTH & Delam repairs, etc.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
New Equipment | Fabrication Services
Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 4mils Copper thickness: 0.5oz Special process : 0.25MM BGA , resin plugged vias in BGA pads
Electronics Forum | Wed May 19 11:50:32 EDT 1999 | Chris Nuttall
We care currently running into problems during our plug via process: At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is cau
Electronics Forum | Wed May 19 13:13:20 EDT 1999 | Dave F
| We care currently running into problems during our plug via process: | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 8350B The totally programmable features and internal memory of the 8350B Sweep Oscillator Mainframe can speed up your repetitious testing needs. A push of a button returns the unit to local control for bench work. Sweep frequency
Used SMT Equipment | General Purpose Test & Measurement
Agilent Keysight E8361A 67 Ghz PNA Network Analyzer This and 400+ other quality test systems available via online auction. Please visit www.xlineassets.com for details. Auction starts soon!!! Equipment Manufacturers: Agilent/HP Tektronix
Industry News | 2018-10-18 10:40:04.0
Via Tent-Holes with Solder Mask
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Parts & Supplies | SMT Equipment
02101977-01 PUSHER NEEDLE GUIDE *S=00201511s01 02101984-01 *SUBSTITUTE=00301620 BELT BIN PLUG-IN AX 02101985-01 *SUBSTITUTE=00301772 BELT BIN PARTITION 02101986-01 *SUBSTITUTE=00310246 BELT BIN PLUG-IN AX 02101987-01 *SUBSTITUTE=00301622 BE
Parts & Supplies | Pick and Place/Feeders
We also supply following Simens Spare parts : 00356342-01 SMD TAPE TO THREAD FOR 12/16mm FEEDER 00356343-02 SMD TAPE CONNECTOR 0,056*48*4,3mm (4000 Pc.) 00356344-01 SMD TAPE CONNECTOR 0,056*48*16mm 00356402S01 SHIM 00356653-01 RETROFI
Technical Library | 2020-07-15 18:49:03.0
Via Filling • Through Hole Vias - IPC-4761 – Plugging – Filling – Filled & Capped • MicroviaFilling and Stacked Vias
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl
SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular
Imagineering, Inc. | https://www.pcbnet.com/blog/making-the-most-of-smaller-components-with-hdi-pcbs/
. VIPPO Structure The increasing usage of HDI printed circuit boards makes the plugging of micro-vias an important aspect of PCB manufacturing
| https://ipcapexexpo.org/education/call-for-technical-paper-form
(for Automotive Applications) Microvia Design and Testing PCB/Pad Repair RF Materials Signal Integrity Solderability Surface Finishes Via Plugging and Other Protection Other… Enter other