Electronics Forum | Fri Feb 22 16:49:44 EST 2008 | pms
Steve, Trying to keep wave solder from coming up the via' from the bottom and adhering to the via's and via's pads during wave. We use WS flux thru-out the whole process. I have been concerned about possible flux intrapment in the via's. That's a g
Electronics Forum | Fri Jan 21 19:30:11 EST 2005 | Dreamsniper
Hi T2, The purpose of this is that we want to make our rework robust. Whenever we rework BGA's we have solder getting trapped into those 1 sided tented vias and bet yah...they are hard to desolder! And during BGA resoldering these trapped solder will
Electronics Forum | Tue Mar 22 08:05:59 EST 2005 | jdumont
Morning all, my question is regarding the use of filled/tented/plugged vias on the BGA site. What are you guys doing for this? What type of issues can this cause if using none, or the improper via design. Regards, JD
Electronics Forum | Thu Feb 21 16:57:02 EST 2008 | flipit
If the vias are large and don't always tent, you can have your pcb supplier double mask the pcb. I do this for COB assembly sometimes because the globtop wicks through the vias and also causes air bubbles in the globtop.
Electronics Forum | Tue Mar 22 20:33:24 EST 2005 | davef
Q1. What are you guys doing for filled/tented/plugged vias on the BGA site? A2. 2221A, 4.5.1 tells you the vias have to be tented on both sides. Q2. What type of issues can this cause if using no filled/tented/plugged vias on the BGA site? A2. BGA
Electronics Forum | Mon Feb 25 12:21:16 EST 2008 | stevek
Rather than having the artwork cover the via as with tenting dry film, and letting the mask do what it will, the preferred way is to do a second op silk screen with something like SR1000 just in the vias themselves to plug them. This doesn't always
Electronics Forum | Fri Jun 09 17:34:08 EDT 2000 | Melanie Mulcahy
I need some information regarding the acceptability/unacceptability of using tented vias with LPI soldermask. Long story on all involved, but basically I have a board that I have had manufactured with no problems which has BGA/uBGA parts, tented via
Electronics Forum | Thu Aug 25 10:17:48 EDT 2005 | davef
Send the pic to dave5252 at hotmail.com [you can't send pic through the SMTnet email thing] For more on via plugging, tenting, capping ... look here: http://www.merix.com/technology.php?section=processes&page=pdf/Via_Fill_Plug.pdf Something, a voi
Electronics Forum | Thu Feb 07 11:59:48 EST 2002 | Ron Costa
When double sided BGA's are used on an .062 FR4 10 layer board should via's be plugged and tented? The CACHE chips being used are PBGA's 1.27mm pitch. The pad size is .030 and the finished via dia. is .010. This is a dogbone type pad and via design.
Electronics Forum | Tue Jan 31 15:44:08 EST 2006 | John S.
We're looking at lead free surface finishes for some of our products. On one supplier's site, I found a note that tenting vias on ENIG boards can lead to the black pad phenomenon. How does this compare to your design guidelines and experience? Than
