Electronics Forum | Thu Feb 21 11:43:09 EST 2008 | dphilbrick
I asume you're not ICT-ing this board and using the vias for test points?
Electronics Forum | Wed Feb 20 18:05:24 EST 2008 | slthomas
Tented vias have solved problems for me in the past, but never created any. I have heard seemingly pointless discussions about whether or not the EE that designed the board designed it with filled vias in mind (a consideration of current carrying c
Electronics Forum | Tue Feb 19 11:08:22 EST 2002 | Chris Anglin
Guideline for Tenting Interstitial BGA Vias It is difficult to give a complete recommendation on via tenting without an idea what process conditions are required (ex: wave pass, double reflow, rework etc.). Via Pads (as Test Points) - On Bottom
Electronics Forum | Mon Feb 06 10:02:14 EST 2006 | Yash Sutariya
Sorry. I actually should clarify those slides. Black pad is not associated with tented vias. Also, you can tent vias with soldermask, but this requires the immersion gold process to be completed prior to soldermask. As such, all copper features (
Electronics Forum | Thu Feb 21 14:54:36 EST 2008 | shrek
KRIKIES! tenting WILL inhibit solder flow through the top-side me lad. In the meantime, me chap, have you tried to adjust wave parameters? i've read threads here that a vibrating wave will tend to push solder up through holes.
Electronics Forum | Sun Dec 26 21:24:55 EST 2004 | tellinghuisen
Dreamsniper What is the rationale for the double plugging? And why from both sides?
Electronics Forum | Thu Sep 21 10:34:20 EDT 2006 | Kerwin Hooshey
Is there an ICT probe style that can pierce through tented (closed) via's?
Electronics Forum | Thu Feb 21 12:04:32 EST 2008 | pms
That is a correct assumption Doug.
