Used SMT Equipment | General Purpose Test & Measurement
Marconi (Aeroflex/IFR) 2023 and 2024 signal generators are portable and lightweight, offering carrier frequencies from 9 kHz to 1.2 Ghz (2023) and 9 kHz to 2.4 GHz (2024). The instruments are suitable for a wide range of applications in laboratory, p
Technical Library | 2009-04-30 18:06:24.0
This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored.
Industry Directory | Manufacturer
PCBCart, a highly skilled PCB Fab, Parts Sourcing & Assembly services provider for global companies, fabricates 23k+ different PCB designs each year, and are committed on the quality & performance of every circuit board it printed
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
Used SMT Equipment | General Purpose Test & Measurement
Agilent Infiniium DSO 80804B Oscilloscope This and 50+ other quality test and measurement system to be sold via auction. Closure of research laboratory - California Visit www.xlineassets.com for a complete catalog.
Used SMT Equipment | General Purpose Test & Measurement
Agilent N5230A 20Ghz Network Analyzer This and 50+ other quality test and measurement system to be sold via auction. Closure of research laboratory - California Visit www.xlineassets.com for a complete catalog.
Used SMT Equipment | General Purpose Test & Measurement
83640L Synthesized Sweeper - 40Ghz This and over 200 pieces of top quality test and measurement equipment to be sold via auction. Hard to find 40Ghz Equipment. Auction Starts Soon - www.xlineassets.com
Used SMT Equipment | General Purpose Test & Measurement
Agilent E8267C Vector Signal Generator 20Ghz This and 50+ other quality test and measurement system to be sold via auction. Closure of research laboratory - California Visit www.xlineassets.com for a complete catalog.
Industry Directory | Manufacturer
PWB designs and manufactures test equipment and provides services to test the reliability of Printed Circuit Boards.
Used SMT Equipment | In-Circuit Testers
JDSU FST-2802-V6 Acterna Ethernet and Fibre Channel services module with FST2000 TestPad The FST2802 is a handheld Ethernet, Fibre Channel, and IP services test instrument designed to meet the needs of service providers for turning up and troub
