Used SMT Equipment | In-Circuit Testers
JDSU FST-2802 Acterna Ethernet and Fibre Channel Services Module The FST-2802 is a handheld Ethernet, Fibre Channel, and IP services test instrument designed to meet the needs of service providers for turning up and troubleshooting these variou
Used SMT Equipment | General Purpose Test & Measurement
The R&S CMW500 marks the entry of a new generation of test equipment from Rohde & Schwarz for fast and precise production of current and future wireless devices. The R&S Smart Alignment high-speed test concept plus the all-in-one architecture with
Used SMT Equipment | In-Circuit Testers
Aeroflex IFR ATC-601 Transponder Ramp Test Set IFR is a leader in the design, manufacture and marketing of Avionics test systems. The ATC-601 performs the ATC transponder test required by the revised Federal Aviation Regulations (91.172 and P
The Boundary Scan Probe serves as a handheld tool for debugging of UUTs and JTAG/Boundary Scan devices. It basically is a virtual JTAG/Boundary Scan pin providing several advantages, e.g. static and dynamic logic pen functionality. Probe the test obj
Used SMT Equipment | General Purpose Test & Measurement
We ship worldwide. Please feel free to contact us if you need further information. World Class Optical Performance & Flexibility* High wavelength resolution: 0.02 nm Wide close-in dynamic range Single Mode and Multimode fiber test capability, vi
Used SMT Equipment | In-Circuit Testers
Exfo FTB-8130NGE Next-Generation Multiservice Test Modules — FTB-8120NGE Features DS0/E0 to OC-192/STM-64/OTU2; 10 Mbit/s to 10 Gbit/s LAN/WAN as well as 1x, 2x, 4x and 10x Fibre Channel testing in a small form factor. Fully integrated solutio
Used SMT Equipment | In-Circuit Testers
JDSU FST-2802-003-1GE-A03-A04 Acterna Ethernet and Fibre Channel Services Module The FST-2802 is a handheld Ethernet, Fibre Channel, and IP services test instrument designed to meet the needs of service providers for turning up and troubleshoot
Industry Directory | Consultant / Service Provider / Training Provider
ERI is a specialized engineering school, focusing on the reliability and durability of hardware, upon the kinds of stresses that can shorten the life of hardware such as yours and upon appropriate tests to uncover weaknesses.
Technical Library | 2021-07-20 20:02:29.0
During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.
Used SMT Equipment | General Purpose Test & Measurement
Agilent Keysight E8361A 67 Ghz PNA Network Analyzer This and 400+ other quality test systems available via online auction. Please visit www.xlineassets.com for details. Auction starts soon!!! Equipment Manufacturers: Agilent/HP Tektronix