Demonstration of JTAG ProVision from JTAG Technologies. The 2nd generation application development toolsuite from the world leading supplier of IEEE 1149.x boundary-scan solutions. To find out more go to: http://www.jtag.com
2024 New Product SMT 8 Working Heads 39 Hole Nozzle Automatic Change+Backup pins Production Pick and Place Machine NeoDen N10P Specification Model NeoDen N10P Nozzle Qty 8 nozzles
2024 New SMT Pick and Place Machine Chip Mounter NeoDen N10P-Automatic 39 hole nozzle change station+Backup support pins Specification Model NeoDen N10P Nozzle Qty 8 nozzles R
Technical Library | 2017-12-21 11:24:05.0
The present work concerns on the use of sensors to monitor the structural health of wind turbine . Conventionally the inspection was made using non-contact sensing during the turbine’s inoperable period hence loss occurred. A real -time monitoring system via embedded wireless sensor is preferred but the sensor could only be implanted using non-contact printing method due to most turbine blade s’ curved surface. Conductive ink associate d with non-contact printing method via fluid dispensing system are proposed since conductive inks are proven stretchable and fluid dispensing system enables printing on various substrates and works well with any materials...
Industry News | 2003-06-13 10:23:02.0
Universal Instruments and Valor Computerized Systems have announced an agreement to interface Valor software products with Universal's manufacturing systems
Technical Library | 2009-04-30 18:06:24.0
This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored.
Industry News | 2019-05-16 01:24:13.0
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.
Rugged Material Feeding Unit for Highly Abrasive Dispensing Media With High Viscosity. Loading of Material From 20-Litre Drums With the Patented Scheugenpflug Barrel Follower Plate. The barrel (hobbock, pail) is positioned on the ergonomic hobbock d
