Electronics Forum: vippo solder hot tear bga (3)

Hot Tear/Shirnk Hole>Will it happen on BGA joint ??

Electronics Forum | Tue Aug 05 01:13:22 EDT 2008 | Sean

Dear all, As far as I know hot tear or shrink hole defect only happen at plated though hole soldering, especially for those lead free wave process. Recently, a laboratory engineer had done cross section on some of the SMT BGA ball and IC lead solde

Hot Tear/Shirnk Hole>Will it happen on BGA joint ??

Electronics Forum | Fri Aug 08 07:15:49 EDT 2008 | davef

Hot tear occurs at the surface of the solder connection. The surface will look like someone tore the surface apart. So, it is a crack or fracture formed prior to metal solidification.

Industry News: vippo solder hot tear bga (1)

SHENMAO to Exhibit Low-Temperature Solder Pastes at SMTA Ohio Expo

Industry News | 2019-07-09 20:13:00.0

SHENMAO America, Inc. is pleased to announce that it will exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, August 8, 2019 at the Holiday Inn Cleveland Strongsville in Strongsville. The company will showcase its PF735-PQ10 low temperature solder paste.

Shenmao Technology Inc.

Events Calendar: vippo solder hot tear bga (1)

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

Career Center - Resumes: vippo solder hot tear bga (2)

2012 resume

Career Center | Columbus, Ohio USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support

20 plus years of experience in a Electronics Manufacturing environment. Management experience on 1st and 2nd shift with groups up to 18 in a goverment contracted environment Experienced internal/lead auditor of ISO 9001 with years of audit experi

2012 resume

Career Center | Columbus, Ohio USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support

20 plus years of experience in a Electronics Manufacturing environment. Management experience on 1st and 2nd shift with groups up to 18 in a goverment contracted environment Experienced internal/lead auditor of ISO 9001 with years of audit experi

Express Newsletter: vippo solder hot tear bga (994)

SMTnet Express - May 16, 2019

SMTnet Express, May 16, 2019, Subscribers: 31,918, Companies: 10,765, Users: 26,116 Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle Credits: Cisco Systems, Inc. As the demand for higher routing density and transfer speed


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