Industry News | 2016-10-04 16:30:12.0
Viscom has developed advanced software to enable highly precise 3D image acquisition in the automatic optical inspection (AOI) area that the company will display in Stand A1.217 at electronica, scheduled to take place Nov. 8-11, 2016 at the Messe München.The representation of side views of electronic components, a pronounced weak point on many 3D systems with orthogonal cameras, can now be displayed in realistic detail with the angled cameras of the Viscom camera modules on the new 360View.
Industry News | 2014-07-28 12:42:54.0
Viscom will present the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market in Booth #A-1C36 at Nepcon South China. Viscom S3088 AOI and SPI systems are designed to flexibly cover even the most challenging requirements, from small series production to high-volume/low-mix. The new XM-3D camera module allows for especially fast inspections, with both high-resolution angled views and 3D analyses.
Industry News | 2018-11-14 15:34:52.0
Viscom AG will premier a new 3D bond inspection system at electronica 2018 in Munich. The Hanover-based inspection technology expert is thus expanding its diverse 3D product range from 3D SPI, 3D AOI and 3D X-ray technology to include bond inspection, further reinforcing its technology leadership in 3D inline inspection for the electronics manufacturing industry.
This compact AOI system was developed to inspect medium and small product runs. During inspection, a high-resolution camera records all bond sites and wires. Dies, bond sites, wire course and component position are only a part of the inspection scope
Fast automatic inspection and high performance sample testing in one system. Two inspection concepts in one system - The best of two worlds. In modern SMT production, components such as BGA, QFN or QFP are gaining ground. Because their connectors a
Industry News | 2012-08-23 12:36:58.0
Smyczek GmbH & Co. KG, based in Verl, Germany, announces that it has optimized its SMT processes with the implementation of 3D paste inspection with Process Uplink by Viscom.
Industry News | 2014-07-28 21:55:58.0
Viscom announced today that they will present the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market in Booth #A-1C36 at Nepcon South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center in China.
Industry News | 2012-10-22 15:54:35.0
Viscom announces that it was awarded a 2012 Global Technology Award in the category of Best Product – Europe for its SPI-AOI Uplink Feature.
Industry News | 2013-03-07 06:42:15.0
Viscom announces that it has been awarded a 2013 NPI Award in the category of Software – Process Control for its SPI-AOI Uplink function.
Industry News | 2012-09-13 13:58:17.0
Viscom will exhibit in Booth #415 at the upcoming SMTA International Exhibition,
