1.Suitable for low and middle viscosity materials 2.The material of valve's body has been hardened. 3.The latest technology of diaphragm has been applied. 4.The material of the parts touched fluid is corrosion-resistant and flexible. 5.The liqui
100% (Test method GB-T7753-87) Storage Details Store under normal conditions of 10° to 30°C and 40 to70% R.H. in their initial packaging. Shelf life is 6 months from the date of
www.techconsystems.com The TS9000 Series Jet Tech is a piezoelectric driven, non contact dispense valve capable of handling fluid viscosities to 2 million Cps. Jet Tech offers a fast jetting action producing hundreds of accurate deposits less than
Application product: straight line box, crash lock box, 4 & 6 corner box, hamburger box, folding, etc Model: KPM-PJ-V24 Controller model: HZ4 Pump model: HB6 Head :1-4pcs; 1-8pcs Input power :AC220V 50-60Hz Air pressure request: 6 bar Adhesive viscos
Technical Library | 2017-08-17 12:23:27.0
A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step for BGAs or CSPs, which exhibit high thermal warpage, to form a high-reliability assembly. Requirements in drop test, thermal cycling test (TCT), and SIR are all met by this epoxy flux, EF-A. The high viscosity stability at ambient temperature is another critical element in building a robust and userfriendly epoxy flux system. EF-A can be deposited with dipping, dispensing, and jetting. Its 75°C Tg facilitates good reworkability and minimizes the adverse impact of unfilled underfill material on TCT of BGA assemblies.
Technical Library | 2022-10-11 17:27:08.0
Lead-free flux technology for electronic industry is mainly driven by high soldering temperature, high alloy surface tension, miniaturization, air soldering due to low cost consideration, and environmental concern. Accordingly, the flux features desired included high thermal stability, high resistance against burn-off, high oxidation resistance, high oxygen barrier capability, low surface tension, high fluxing capacity, slow wetting, low moisture pickup, high hot viscosity, and halogen-free. For each of the features listed above, corresponding desired chemical structures can be deduced, and the impact of those structures on flux residue cleanability can be speculated. Overall, lead-free flux technology results in a greater difficulty in cleaning. Cleaner with a better matching solvency for the residue as well as a higher cleaning temperature or agitation are needed. Alkaline and polar cleaner are often needed to deal with the larger quantity of fluxing products. Reactive cleaner is also desired to address the side reaction products such as crosslinked residue.
Lite Fast 3010-M is a low viscosity, one-component conformal coating. It was specifically developed for printed circuit boards (PCBs) as well as hybrid and integrated circuits for military application. Low viscosity enables the resin to flow betwee
Appling Scope: For needs to select the more different quantity deposit on the sole work piece the product to suppose. Precision Tolerance:0.001S Key Features 1.The digital dispenser has three modes of operation (manual, timed and cycling)
World's First Super Fast Low Temperature Underfill. SMT88U is an adhesive, which combines the advantages of fast cure in UV adhesives, and the better reliability of capillary underfill. It can be underfilled at room temperature without preheating a
High viscosity impellor-less mixing fast and effective mixing simple bubble dispersion different size machies to suit USB connection to PC (software icluded) no machine clean-up no cross-contamination fast changeover of compound types reusable and di
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