New Equipment | Rework & Repair Equipment
The PDR E3S SMD Rework Station offers dual closed loop feedback for advanced BGA Repair, QFN Repair, Flip Chip Repair, DFN repair, QFP's, SOIC's and more, and is is engineered with only the finest materials and components for optimum precision and r
New Equipment | Rework & Repair Equipment
PDR E3M Rework System for Micro SMD Rework is made of only the finest materials and components for Micro- BGA Rework, 0201 Rework, CSP Rework, uBGA Rework, LED Rework, area Array Rework, and similar micro applications. Combining PDR's ThermoActive s
Electronics Forum | Wed Apr 11 14:57:31 EDT 2007 | itwasbill
Hi all! We are placing BGA's using a QSV-1 pck and place machine. I believe our profile has the correct information but we continue to get vision results not available when we inspect the part. Our screen appears as follows: NO RESULTS AVAILABLE PAR
Electronics Forum | Sun Sep 29 09:48:01 EDT 2013 | jvadillo
Hi, we have finally purchased the following second hand equipment: - TWS Quadra pick&place from 2004 - TWS 1100 oven - Motoprint-M automatic screen printer We are quite happy for the price we paid and what we have obtained. The PnP needs some n
Industry News | 2008-11-18 17:22:43.0
Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels. Essemtec has developed a system that can dispense and place in three dimensions and is capable of placing 3D-MID technology.
Parts & Supplies | Pick and Place/Feeders
Which series nozzles could be used for Phlips Topaz and Emerald machine As we know, many parts are compatible for Yamaha and Philips machines, but some models their nozzles are not generic.So which series nozzles could be used for Phlips Topaz and
The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the t
Small Pick and Place factory, contact talia@zidatek.com http://www.zidatek.com/ http://www.zida-ele.com/
. During QFP analysis, for example, the rotational acc
SMT Express, Volume 5, Issue No. 3 - from SMTnet.com Return to Front Page << Back to Page 3 Page 5 >> Thirdly, the actual measurement of component placement starts. During QFP analysis, for example, the rotational accuracy can
Industrial Sensor Vision International specializes in advanced camera technology of high resolution fast speed cameras for automation, AOI, 2-D/3-D, SPI inspection and wafer inspection.
3 Morse Road 2A
Oxford, CT USA
Phone: +1 203 592 8723
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