Used SMT Equipment | Soldering - Wave
Model: 6622CC Vintage: 2006 Details: • Windows 7 operating system • Lead Free capable (was running lead, and will need tin wash). • 18” max width adjust • Measured Values Read-out of Frequency controlled motors on PC screen • 400V / 3 Phase
Used SMT Equipment | Soldering - Reflow
Very Nice, Super Clean, and Low Use Vitronics XPM2 Reflow Oven For Sale See attached pictures and information below Equipment Description Vitronics Soltec XPM2 820 Reflow Oven Model Number: XPM-820 Serial Number: X2A80106 Year: 2004 Left to
Used SMT Equipment | Soldering - Reflow
Very Nice Vitronics XPM3 Reflow Oven For Sale See attached pictures and information below Equipment Description Vitronics Soltec XPM3 820 Reflow Oven Model Number: XPM3i820 Serial Number: X3A83008 Year: January 2011 Left to Right Process Flo
Used SMT Equipment | Soldering - Reflow
Vitronics Soltec XPM2-1030 – Reflow Soldering Manufactured Year: 2008 Serial Nr: X2n102021 Direction: Right to Left Heating Zones: 10, Top and Bottom Cooling Zones: 3 with Water Cooler Total Heating Length (mm): 3.350 Total Coolin
Used SMT Equipment | Soldering - Reflow
2004 Vitronics XPM2 1030 The Vitronics Soltec XPM2 1030 is a reflow soldering and curing system used in electronics manufacturing. Here are some key specifications and features: Dimensions & Weights: Heating zones: 5 Cooling zones: 2 Total heating
MPM Printer: EdgeLoc™ uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps for optimum accuracy and repeatability.
Industry News | 2016-05-09 21:21:15.0
SMTA China announces that it presented awards for Nine papers at the SMTA China East 2016 Conference Award Presentation Ceremony, held on Tuesday, April 26, 2016 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.
The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
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