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1128 vitronics and 2010 and new and xpm2 and lead and free results

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Trace, Track and Control: High Production Output at Low Costs

Leaded and Lead-Free Solder Paste Evaluation Screening Procedure

New Methods of Testing PCB Traces Capacity and Fusing

A High Performance and Cost Effective Molded Array Package Substrate

SMT Placement for ICs, Connectors and Odd Shaped Components

Solder Phase Coarsening, Fundamentals, Preparation, Measurement and Prediction

Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder

DOE for Process Validation Involving Numerous Assembly Materials and Test Methods

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints.

Discover New Technologies, Processes, Equipment and Solutions at IPC APEX EXPO 2012

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