Electronics Forum | Tue Jan 21 16:28:02 EST 2003 | tony_sauve
Sorry I didn't close this one off last year... We had some failure analysis done on these PCB's ( 3D x-ray,microsectioning,SEM) and the results definitively proved that there was some contamination @ the base of the uvia's that had the voiding. It ap
Electronics Forum | Mon May 05 11:48:33 EDT 2003 | mk
We have had good luck with via in pads using solid solder deposition. Please contact me off line or provide a number I can call. Thanks Matt Kehoe m.j.kehoe@att.net
Electronics Forum | Tue Nov 20 20:58:43 EST 2001 | davef
Very coo!!! [You have done an outstanding job of describing your situation.] I guess the via are connected to a BIG chunk of copper that affects your profile on that pad / ball. At the same time, run a profile each on a: * Void pad * Nonvoid pad
Electronics Forum | Sat Nov 24 22:15:16 EST 2001 | Glenn Robertson
Tony, I'm not sure if even baking will stop the voids if you have gaps in the plating. It probably doesn't take much moisture or even trapped air. I'm not speaking from a lot of direct experience here, so please run the tests and let us know wh
Electronics Forum | Thu Nov 22 12:56:12 EST 2001 | tony_sauve
Thanks for the comments & suggestions. Here's some info garnered from a telecon w/the PCB Fab house: -the blind via's extend from layer 2-17...this was a revelation. The info from our customer was that the via's only extended down 2 layers. Did I men
Electronics Forum | Sat Dec 20 14:06:58 EST 1997 | Vincenzo Longobardo
what is your experience about the presence of the voids in the joints ? Are they dangerous and when ?
Electronics Forum | Mon Nov 11 10:57:03 EST 2002 | davef
Search the fine SMTnet Archives for background on voiding in BGA
Electronics Forum | Thu Apr 17 13:35:49 EDT 2003 | davef
A-610 talks to acceptable voiding.
Electronics Forum | Tue Feb 19 22:50:00 EST 2008 | amarpreet41
Do you of reducing hole size of DIMM connector will improve solder voids??
Electronics Forum | Mon Jan 21 11:37:35 EST 2008 | rayjr1491
Is there a tool to check for voiding in a Underfill process?