Industry News | 2012-03-08 21:29:50.0
Nordson DAGE will highlight its new X-Plane™ technology in Stand C7 at the upcoming National Electronics Week (NEW) South Africa, scheduled to take place March 13-14, 2012 at the Sandton Convention Center in Johannesburg.
Industry News | 2012-04-27 13:32:30.0
Nordson DAGE has been awarded a 2012 EM Asia Innovation Award in the category of Test & Measurement/Inspection Systems – AXI for its new X-Plane™ Analysis – Sub Micron X-Ray Inspection System Option.
Industry News | 2012-07-02 09:45:46.0
No has been selected as a Best of West finalist for its X-Plane™ Analysis – Sub Micron X-Ray Inspection System Option.rdson DAGE
Industry News | 2012-10-17 11:19:43.0
Nordson DAGE announce that it has been awarded a 2012 Global Technology Award in the category of Software – Production for its X-Plane™ Analysis – Sub Micron X-Ray Inspection System Option.
Industry News | 2021-05-21 03:56:59.0
LED lamp bead because of energy saving, low carbon environmental protection, no strobe, no radiation, high brightness, low heat advantages are gradually replacing the fluorescent lamp on the market, its application scope is expanding,although LED has many advantages, if the production or operation is not appropriate,there will be LED strip use fault phenomenon. LED lamp strip manufacturers also begin to pay more and more attention to the problem of production quality, then what equipment can be used for LED lamp strip backlight detection? Unicomp Technology here recommended AX8200L LED strip backlight detection equipment.
Industry News | 2017-03-06 05:20:47.0
For over 30 years we have been offering hands-On and theory workshops in all aspect of electronic assembly. From practical skills like manual soldering, component handling plus wiring and assembly to the most advanced area array, flip chip and laser soldering technology http://www.bobwillis.co.uk
Electronics Forum | Tue Sep 04 02:28:17 EDT 2007 | philip_yam
Any one has experience over solder voids in oscillator capacitor joint could result in high phase noise during the digital performances test? The noise signal was gone after solder touch up. What could be the root cause of the high phase noise?
Electronics Forum | Tue Sep 04 10:27:33 EDT 2007 | rgduval
I haven't experienced this problem, exactly, but I have had issues with noise in digital circuits that appear to have gone away with touch up. The problem was that the customer blamed the noise issue on the solder quality, and he pointed to the fact
Electronics Forum | Fri Jun 16 11:37:15 EDT 2006 | docker
I�m working in Solder paste manufacturing industry and my customer has complained the void issue on BGA pad. I�m internally conducting the void test on BGA pad in my Lab. I used OSP furnish board with Sn/Pb and /or lead free component using Lead free
Electronics Forum | Thu Sep 02 07:50:27 EDT 2010 | sachu_70
Just to add to my comments,solder joint voids do occur in LGA. Voids in LGA can be larger due to geometry and greater ratio of flux to solder. IPC-A-610D specifies a greater than 25% voided area is a defect for BGA, however, it does not specify the d
