Electronics Forum | Fri Mar 23 09:13:48 EDT 2007 | Peter W
Hello, those plated and solderable via in pads have two critical points: 1. We have discovered that _sometimes_ the plating seems not to be perfect, as extreme voiding is visible in tha bga solder ball 2. The detection of some defects by AXI is limi
Electronics Forum | Wed Feb 20 12:22:14 EST 2008 | tonyamenson
iv40, I don't suppose you know/remember what base material you were using that caused the problem and what material you switched to was, do you? We just pre-bake all our lead free PCBs as a precuation but I would like to remove the process if I can
Electronics Forum | Wed Apr 16 16:55:38 EDT 2003 | russ
Thanks for the info, Here is a couple more questions (and you thought you were done) What size are these caps /res? how thick is your stencil? what type of oven are you using? what is the finish of the board? Anyway, it seems like (from a distance)t
Electronics Forum | Thu Apr 17 13:00:28 EDT 2003 | Takfire
Russ, The caps are 0603 case size. I am not sure about the manufacturing details, as I work for the capacitor supplier. The manufacturing details are unclear at the moment, as the customer (South of the border) has not released such detailed inform
Electronics Forum | Thu Apr 17 17:38:57 EDT 2003 | Takfire
Dave, I am not exactly sure what is driving them to believe that this is a capacitor issue. It is unfortunate, that this belief has slowed their activity in further understanding their manufacturing process. The caps are BME (Base Metal Electrode
Electronics Forum | Tue Mar 06 09:18:33 EST 2001 | davef
Two things: 1 Go to IPC and buy "TP-1115 - Selection & Implementation Strategy for A Low-Residue No-Clean Process - Provides direction to electronics manufacturers interested in adopting low residue (LR) assembly technology. It addresses the concern
Electronics Forum | Mon Jan 25 13:42:35 EST 2010 | patrickbruneel
This is a post from another forum as a response from Bob Landman to a claim that he had no evidence to be concerned about lead-free in hirel applications (interesting read). See below and am sure many technetters will find this interesting **********
Electronics Forum | Fri Jan 15 13:35:03 EST 1999 | Terry Burnette
| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat
Electronics Forum | Mon Dec 22 16:02:22 EST 1997 | Justin Medernach
| what is your experience about the presence of the voids in the joints ? | Are they dangerous and when ? Vincenzo, Voids in solder joints can be caused by a number of factors. Let's begin with the flux vehicle in your soldering media. If the prope
Electronics Forum | Wed Feb 05 15:16:15 EST 2003 | davef
If the voiding is not related to entrapped air in your vias, consider trying a different paste.
.gif)
.gif)
winsouce.jpg)