Electronics Forum | Fri Feb 07 15:17:14 EST 2003 | MA/NY DDave
Hi I am pretty sure it isn't the pad that is causing the problem. To me it seems like those via holes through the pcb either to an internal plane or to the other side. I can imagine creating an interesting stencil to accomodate the vias yet you are
Electronics Forum | Fri Feb 07 16:10:14 EST 2003 | MA/NY DDave
Hi Gee, It seems funny to comment on your own post. I notice that the original poster and a respondent, like me, are striving to create some voiding by design to improve the way this joint will form. NEAT!! I still think that those vias as DaveF p
Electronics Forum | Wed May 16 11:34:55 EDT 2001 | b123084
I am looking for a conformal coating to protect a PWB that will be completely submerged in water. Unfortunately polyurethane will not work because it will not fill all of the small spaces and leaves voids.
Electronics Forum | Fri Feb 07 11:58:47 EST 2003 | dphilbrick
We went to Indium WS to help reduce this type of issuse as well might want to think about a cross through the middle this has also helped us on similar issues.
Electronics Forum | Wed Nov 14 01:18:20 EST 2007 | reypal
How about your bare pcb handling? do you stuff smd component prior hand soldering? you can try to bake the pcb and then see if this problem still exist.
Electronics Forum | Wed Jun 12 14:42:40 EDT 2013 | armandogomez
Hello guys ! I am here again with a problem, right now we have a problem with a new product, the problems are with voids with the PTH we put a receptacle with terminal blades that are 1.3mm width in a pth with a diameter of 1.5mm we use a pallet to
Electronics Forum | Sun Mar 26 19:02:05 EST 2006 | ms
Hi We are running automatic stencil printers, open squeegees, stainless stencil, stainless blades, print speed 25-30mm/sec. We have a frustrating consistency issue printing .37x.3mm apertures on a 45pin LGA (11 pads each side, 1 large ground in mid
Electronics Forum | Fri Jan 15 09:27:18 EST 1999 | Earl Moon
| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat
Electronics Forum | Tue Nov 13 21:59:42 EST 2007 | davef
This processes has the potential to cause barrel cracking and pad lifting, because the heating is very hot [troop crank-up the volume on their iron when they see thick boards] for a relatively small area on one side of the board. What do we suggest
Electronics Forum | Tue Oct 27 16:22:00 EDT 2009 | davef
It's not the first thing we think of in looking at your picture. First off, the lack of copper in the region of the red oval makes us think of a plating defect. We don't expect that moisture out-gassing through the barrel wall to show-up on opposite
