Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
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Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Technical Library | 2021-04-21 19:28:30.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness.
Technical Library | 2021-04-21 15:10:16.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages they offer, the use of Ball Grid Array packages is common across all industry sectors. They are also prone to process voiding issues. This study was performed to determine if vacuum assisted reflow process can help alleviate the voids in area array solder joints. Test parameters in this study largely focused on vacuum pressure level and vacuum dwell time.
Technical Library | 2022-10-31 18:35:40.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages they offer, the use of Ball Grid Array packages is common across all industry sectors. They are also prone to process voiding issues. This study was performed to determine if vacuum assisted reflow process can help alleviate the voids in area array solder joints. Test parameters in this study largely focused on vacuum pressure level and vacuum dwell time.
Technical Library | 2013-02-08 22:56:47.0
Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the total void content is minimal. X-ray methods are the predominate method for solder void analysis but this method can be quite subjective for non grid array components due to the two dimensional aspects of X-ray images and software limitations. A novel method of making a copper "sandwich" to simulate under lead and under component environs during reflow has been developed and is discussed in detail. This method has enabled quantitative solder paste void analysis for lead free and specialty paste development and process refinement. Profile and paste storage effects on voiding are discussed. Additionally an optimal design and material selection from a solder void standpoint for a heat spreader on a BCC (Bumpered Chip Carrier) has been developed and is discussed.
Used SMT Equipment | Soldering - Reflow
Newly-designed low-height lid is adopted on Heller 1936 MK7, simplifying the operation and maintenance, reducing the temperature of the surface, and saving energy. The vertical curing oven developed by Heller is available to replace the traditional
Technical Library | 2019-07-24 23:55:32.0
Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder paste, there is a high propensity for voiding due to the confined nature of the solder paste deposits under the component. Once reflowed, many factors contribute to the amount of voiding in a solder joint such as the reflow profile, designs of the component, board and stencil, and material factors. This study will focus on the solder paste alloy and flux combination as well as profile and board surface finishes.
