Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Mon Jan 29 10:11:12 EST 2007 | muse95
What does your customer want you to do? I would not want a CM soldering one of my boards with leadfree paste if I didn't ask him to. Whatever you do, get approval first. Two things to consider: If the other components are not rated for leadfree tem
Industry News | 2016-09-07 19:04:13.0
Kurtz Ersa North America is pleased to announce that Viktoria Rawinski, Assistant to the CEO of the Kurtz Ersa Group and head of the Kurtz Ersa Company Museum and the Corporate History Department, will present the paper entitled, “Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate – Process Integration in Industrial Production,” during SMTA International. The presentation is scheduled to take place during Session MFX4, entitled, “Reflow and Soldering Technology: Void Reduction” on Wednesday, September 28, 2016 from 10:30 a.m. to 12 p.m. in Room 49.
Technical Library | 2007-04-04 11:43:41.0
The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature.
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
) of the system while still achieving the void rate reduction < 1%. Another key capability that will be explored is the elimination of solder splatter during the process of vacuum purge down
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sealant-equipment/products/meters-and-metering-systems/steadi-mix-2k
Suitable for production and mixing of: Polysulfides, two-component epoxies and two-component, low-density void fillers, syntactic materials
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