Industry News | 2022-01-10 16:28:20.0
Once again, customers looking for leading-edge test solutions can come to Seica's booth 1100 and view the future of Flying Probe test in the form of the new PILOT VX platform. Fast, Powerful and Smart: the Pilot VX raises the bar of flying probe test performance, with cutting-edge solutions that address the fundamental concerns of electronic board manufacturers looking to optimize their investment.
Industry News | 2021-10-14 13:49:10.0
Viscom AG is presenting its latest inspection systems and solutions for the widest possible range of the electronics industry's testing requirements at this year's productronica. The company's experts will be on Stand A2.177 to explain to visitors how ultra-precise defect detection, exact measurements and intelligent evaluation during manufacture blend seamlessly together into perfect and sustainable inspection processes.
Electronics Forum | Thu May 03 14:35:13 EDT 2018 | jimpat
Also, are there any other industry practices for void reduction? I read that Nitrogen helps.
Electronics Forum | Mon May 06 11:45:32 EDT 2019 | slthomas
There are quite a few papers out there on the subject. Just enter "SMT void reduction" into google or other search engine and take your pick. That said, slow ramp rates and paste volume reduction are a good place to start. Although I haven't tried i
Electronics Forum | Thu Jun 22 17:47:05 EDT 2006 | davef
First, we expect voiding in imm silver to be similar to ENIG. We expect more voiding in OSP than other common solderability protection. Second, choosing a solder paste, which does not contain resins and activators that decompose at higher temperatu
Electronics Forum | Wed Apr 21 19:32:13 EDT 2021 | davef
Here's some information about Fred Dimock's work on vacuum reflow - Operation of a Vacuum Reflow Oven with Void Reduction Data [ https://smtnet.com/library/index.cfm?fuseaction=view_article&article_id=3336&company_id=40492 ]
Electronics Forum | Wed Jul 16 21:38:27 EDT 2003 | sam
I have done a DOE on the SMT components, not the BGA, for reducing void within the solder. The result did not help in the void reduction, but confirmed that the speed of the IR oven, solder paste thickness may be the important factors for the void.
Electronics Forum | Fri Feb 01 19:07:57 EST 2013 | hegemon
We have had some success in void reduction with LGA by pre-tinning or "bumping" the devices before placement. The extra solder seems to allow a slightly higher standoff, and allows better outgassing, is my guess. A lot more labor , but the results
Electronics Forum | Fri Nov 22 15:59:43 EST 2002 | GSW
What type of reflow profile are you using ? There is a void reduction profile recommeded by some paste manufacturers, Try that it might help. Did you check the components or the board and see if they have absorbed mositure ? try baking the boards and
