Electronics Forum | Mon May 27 04:40:21 EDT 2019 | SMTA-Rogers
Dear Steve, We already to do some DOE of reflow profile, but the optimized parameters are not help for the reduction of voids.
Electronics Forum | Fri Oct 06 09:38:11 EDT 2006 | C.K. the Flip
Here's the BGA voids-reduction profile that I used: http://img323.imageshack.us/my.php?image=profileka0.jpg Keep in mind, this was for Sn/Pb BGA with Sn/Pb solder paste. For your situation, you might want to raise the peak temperatures to at least
Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson
Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part
Electronics Forum | Wed Mar 15 11:43:45 EDT 2017 | rob
Hi PZ, What, sort of like this one? http://creativeelectron.com/papers/EconomicsofLEDVoiding.pdf It even has the handy calculation for the reduction in thermal performance with voiding.
Electronics Forum | Fri Mar 17 21:38:55 EDT 2017 | jlawson
I think the main driver is MTBF data driven by the Car OEMS, mainly german makers pushing this onto suppliers in supply chain. Vacuum soldering and void reduction is a hot topic for the leading electronics suppliers in Germany at the moment. Is not r
Electronics Forum | Mon Aug 30 10:17:16 EDT 2010 | markgray
We currently use this devise in one of our designs with no issues. We are using a 3mil stencil and a 45% apperature reduction. It is virtually impossible to eliminate voids but they are in an acceptable range. Solder balls are caused on this componen
Electronics Forum | Wed Aug 26 12:06:44 EDT 2009 | clampron
Good Morning, I have been struggling with this part for some time now. I have to agree that whoever designed this part, did not have to manufacture with it. We have advanced to a point where they have a acceptable yield but I believe that will be hi
Electronics Forum | Mon Apr 27 19:31:12 EDT 2009 | stevek
Remember that the 25% is a reduction in cross sectional area. A void in the middle of the ball that reduces the cross sectional area by 25% is about half the diameter of the ball. If it is closer to either termination, the corresponding size would
Electronics Forum | Wed Sep 01 06:18:05 EDT 2010 | grahamcooper22
Dear SMT Manufacturer, As moisture is eliminated as the cause then solder paste volume will probably be the main contributing factor. More paste means more chance of solder balls and more flux fumes that need to be evaporated to reduce voiding. Even
Electronics Forum | Tue Apr 29 11:19:09 EDT 2003 | davef
Metallization failure. A defect such as voids, cracks, separations, depressions, notches or tunnels or any combination in the cross sectional reduction that is a basis for rejection.
