Industry News | 2014-10-30 19:03:02.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Peter Koch, European X-Ray Application Engineer, will present at their Distributor Etek’s Technology Event, scheduled to take place November 5-6, 2014 in Prestwick, Scotland. Koch will present “Failure Analysis with X-Ray – in 2D, Tomosynthesis and CT.”
Industry News | 2014-10-13 16:23:05.0
Nikon Metrology will be presenting Inspect-X 4.1 at Electronica Munich from 11-14 November, their latest release of the acquisition and analysis software for Nikon Metrology's range of X-ray and CT systems. The new technology provides improved real-time imaging and advanced BGA analysis.
Industry News | 2014-02-18 17:06:29.0
VJ Electronix, Inc. will exhibit in Booth #2553 at the APEX EXPO 2014 exhibition and conference, scheduled to take place March 25-27, 2014 at the Mandalay Bay resort and Conference Center in Las Vegas, Nevada.
Industry News | 2014-07-29 06:22:46.0
VJ Electronix, Inc. will exhibit in booth A-1J45 at NEPCON South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention and Exhibition Center in Shenzhen, China.
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Industry News | 2012-09-17 16:26:16.0
Nihon Superior, has announced details of its participation in the Technical Program of SMTAI 2012
Industry News | 2024-05-06 12:10:17.0
VJ Electronix, Inc. is proud to unveil its latest addition to the lineup: the APOGEE 130. The new APOGEE 130 offers superior resolution, manual and automated operation, and ease of use typically found in higher-cost systems, all at an affordable price point.
The X2 is an advanced In-line X-RAY inspection system designed for high-speed automatic inspection in production lines. Transmission X-RAY technology is combined with patented Slice-Filter-Technology (SFT) for double-sided PCB assembly and component
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Industry News | 2012-01-17 16:27:31.0
Nordson DAGE will introduce X-Plane™ to the U.S. market for the first time in Booth #3208 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.
