Full Site - : voiding bga (Page 13 of 68)

New X-Plane™ Technology from Nordson DAGE Earns a 2012 Innovation Award during NEPCON China

Industry News | 2012-04-27 13:32:30.0

Nordson DAGE has been awarded a 2012 EM Asia Innovation Award in the category of Test & Measurement/Inspection Systems – AXI for its new X-Plane™ Analysis – Sub Micron X-Ray Inspection System Option.

Nordson DAGE

Nordson DAGE Named 2012 Best of West Finalist for New X-Plane™ Technology

Industry News | 2012-07-02 09:45:46.0

No has been selected as a Best of West finalist for its X-Plane™ Analysis – Sub Micron X-Ray Inspection System Option.rdson DAGE

Nordson DAGE

Nordson DAGE’s New X-Plane™ Technology Wins Its Third Industry Award

Industry News | 2012-10-17 11:19:43.0

Nordson DAGE announce that it has been awarded a 2012 Global Technology Award in the category of Software – Production for its X-Plane™ Analysis – Sub Micron X-Ray Inspection System Option.

Nordson DAGE

Bob Willis Electronics Assembly Video Library

Bob Willis Electronics Assembly Video Library

New Equipment | Education/Training

Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for

ASKbobwillis.com

SHENMAO Low-Temperature Solder Paste PF735-PQ10-10 Is Designed for High-Speed Printing Processes

Industry News | 2024-03-18 13:22:09.0

SHENMAO Technology is pleased to announce that its PF735-PQ10-10 Low-Temperature Lead-Free Solder Paste is specifically designed for SMT processes, offering a low melting point to accommodate high-speed printing processes. Designed to meet the evolving needs of the electronics manufacturing industry, PF735-PQ10-10 offers a range of features and benefits to enhance SMT processes and improve production efficiency.

Shenmao Technology Inc.

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability

Industry News | 2017-11-28 09:32:15.0

SHENMAO Technology introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues, produces the lowest void and easily fit complicated PCB designs through excellent convergence performance.

Shenmao Technology Inc.

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability, Sponsors MEPTEC SEMICONDUCTOR PACKAGING SYMPOSIUM November 30, 2017, E

Industry News | 2017-11-28 19:46:04.0

SHENMAO Technology, Inc. introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues, produces the lowest void and easily fit complicated PCB designs through excellent convergence performance.

Shenmao Technology Inc.

SHENMAO Develops Thermal Fatigue Resistant Solder Paste for High-Reliability Requirements

Industry News | 2022-03-14 08:20:37.0

SHENMAO America, Inc. is pleased to introduce its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy, which is designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.

Shenmao Technology Inc.

Indium Corporation's Dr. Lee, Dr. Liu, Keck and Page Recognized with Honorable Mention at IPC APEX EXPO

Industry News | 2014-03-27 11:31:00.0

Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, Dr. Yan Liu, research chemist, Joanna Keck, research technician and Erin Page, research technician, were awarded Honorable Mention for their paper Voiding and Drop Test Performance of Lead-Free Low-Melting and Medium-Melting Mixed Alloy BGA Assembly at the opening ceremony of the IPC APEX Expo on March 25.

Indium Corporation

MatriX Technologies to Debut Latest in X-ray Inspection at productronica

Industry News | 2013-11-05 15:50:55.0

MatriX Technologies will debut its latest innovation in semiautomated X-ray inspection — the XT-3 — in Hall A2, Booth 159 at the productronica International Trade Fair, scheduled to take place November 12-15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.

MatriX Technologies GmbH


voiding bga searches for Companies, Equipment, Machines, Suppliers & Information