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StencilMate™ Leadless Device Rework Stencils

StencilMate™ Leadless Device Rework Stencils

New Equipment | Solder Paste Stencils

Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o

BEST Inc.

QFN Rework Using Polyimide Stencil

QFN Rework Using Polyimide Stencil

Videos

Video demonstrates easy to use leadless device rework process using polyimide stencil. This is the process described in IPC 7711/21 Procedure 5.8.1.1. and 5.8.1.2. For More Information Visit Our Site: http://www.solder.net/services/qfn-rework For

BEST Inc.

PCB Rework & Repair Services - BEST, INC.

PCB Rework & Repair Services - BEST, INC.

Videos

This video presents the capabilities of BEST Inc in terms of its ability to perform high end PCB rework and repair services. BEST Inc., located in Rolling Meadows IL is a company of soldering "geeks". We rework/repair PCBs, train and certify solderin

BEST Inc.

Improve board level reliability by reducing solder joint voiding below 10%

Industry News | 2023-11-20 13:47:24.0

MacDermid Alpha Electronics Solutions launches ALPHA® OM-362, its latest next-generation low-void solder paste.

MacDermid Alpha Electronics Solutions

Nicolet NXR-1410HR

Nicolet NXR-1410HR

Used SMT Equipment | X-Ray Inspection

Nice used Nicolet/Focal Spot X-Ray inspection machine. Factory refurbished by Focal Spot w/new tube at time of refurbishment. Believed to have been refurbished in 2012-2013 based on paperwork. 90KV Windows 7 PC with BGA void analisys software

Techmech Inc.

The Last Will And Testament of the BGA Void

Technical Library | 2015-01-05 17:38:26.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Rockwell Collins

Phoenix Nanome/x 180

Phoenix Nanome/x 180

Used SMT Equipment | X-Ray Inspection

This Phoenix X-Ray system will be available in the M-Flex Online Auction being held on Dec. 14-15. These assets are located in Anaheim, California and will be sold to the highest bidder. Phoenix Nanome/x 180 X-Ray System; Model: Nanome/x 180; SN: A

X-Line Asset Management

Glenbrook RTX-113

Glenbrook RTX-113

Used SMT Equipment | X-Ray Inspection

GlenBrooks RTX-113, real time X-ray system X-Ray tube was replaced (apx $7.5k value) 12" Monitor, X-Ray Tube, Power Supply and Controls. Glenbrooks patented XRTV High Sensitivity X-Ray Camera, enhanced with eight frame recrusive averaging. Image

Assured Technical Service LLC

Phoenix Microme|x

Phoenix Microme|x

Used SMT Equipment | X-Ray Inspection

Phoenix Microme|x 160 kV 160 kV proprietary sub-micron X-ray source (open design) with “unlimited” lifetime, including a demountable collimator for enhanced image quality X-ray protection cabinet, including laser-crosshair positioning aid

KEERS Technologies

Shuttle Star Technology Co., Ltd.

Industry Directory | Manufacturer

Shuttle Star Technology designs and builds advanced off-line 2.5D&3D x-ray inspection systems for solder joint and final assembly test inspection in SMT&EMS. It uses world-class X-ray techniques with advanced defect detection.


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