Industry News | 2001-11-13 13:41:24.0
Glenbrook Technologies Inc., an innovator and leading supplier of Real-time X-ray Inspection Systems to the electronic fabrication and semiconductor assembly industries has announced the availability of a newly developed large capacity, ultra-high resolution X-ray inspection system called the "Oversized Jewel Box 70-T". Glenbrook's award-winning X-ray camera technology combines a 10 Micron, 70kV X-ray source with extremely small "Source to Image Distance" (SID) to capture ultra-high resolution images.
Industry News | 2021-03-12 04:52:58.0
MacDermid Alpha Electronics Solutions announces the release of ALPHA OM-220, its latest innovation in low-temperature solder technology.
Industry News | 2019-08-15 07:31:59.0
AXI is short for automated X-ray inspection, it's one of the most commonly used approaches for defect inspection in PCB Assembly.
Industry News | 2014-05-07 10:51:17.0
Indium Corporation technology experts will present at the IPC Southeast Asia High Reliability Conference May 28 in Singapore.
"The IR 3000 offers advanced surface mount rework capability in an integrated, cost-effective, bench-top work station." This video covers the basic processes of the IR 3000, focusing primarily on: Installations, Removals, Component Alignment and Ins
Industry News | 2010-03-24 14:00:36.0
ITASCA, IL - Kester announces that representative Gardner & Meredith will showcase its NXG1-HF, a lead-free no-clean solder paste, at the upcoming SMTA Atlanta Expo and Tech Forum, scheduled to take place Thursday, April 15, 2010 at the Gwinnett Civic Center in Duluth, GA.
In this video we show you how to perform an automated x-ray inspection using the TruView Prime
Industry News | 2013-02-21 06:57:08.0
VJ Electronix, Inc.,announces that it has been awarded a 2013 NPI Award in the category of Test & Inspection – AXI for its Vertex II next-generation X-ray technology.
Industry News | 2015-10-13 19:27:42.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void (
Industry News | 2016-05-21 07:36:35.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
