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MX-3600 Entry-level high-speed AXI System

MX-3600 Entry-level high-speed AXI System

New Equipment | Inspection

The MX-3600 is an In-line X-RAY inspection system with the new MIPS-inspection platform of MatriX Transmission X-RAY technology is combined with the patented Slice-Filter Technology (SFT) for double-sided or overlaying applications. The high speed MX

MatriX Technologies GmbH

Image Processors For Real-Time X-ray Inspection Systems

Image Processors For Real-Time X-ray Inspection Systems

New Equipment | Inspection

GTI-5000 BGA "Surface Mount" PCB Analysis The GTI-5000 Computer Image Processor is designed for the x-ray analysis of surface mount, BGA and PCB components. The software can provide analysis of BGA defects including bridging, voids and missing ball

Glenbrook Technologies

Bga X-ray Inspection And Rework Machine x6600 welding x-ray equipment

Bga X-ray Inspection And Rework Machine x6600 welding x-ray equipment

New Equipment | Inspection

Major applications: PCBA BGA/IC LED  Aliminum die casting Battery  connector inspecting 1. Semiconductor package 2. Electronic connector module. 3. Original Package 4. Aerospace components 5. Medical appliances  6. Automation components X-ray In

Seamark Zhuomao Photoeletric technology(Shenzhen)CO., ltd

PCB x ray machine X-6600 x ray weld inspection equipment for chip bubble inspect

PCB x ray machine X-6600 x ray weld inspection equipment for chip bubble inspect

New Equipment | Inspection

Application Field BGA/IC LED Aluminum Die casting Battery Connector Main Features of X-6600 X-Ray inspection machine *  Closed Tube From HAMAMATSU Japan *  Imported Detector from Korea Rayence *  Micro-focus,focal spot size down to 5µm

Seamark Zhuomao Photoeletric technology(Shenzhen)CO., ltd

Seamark zm X-6600 X-Ray Images Machine for Semiconductor, Packing components

Seamark zm X-6600 X-Ray Images Machine for Semiconductor, Packing components

New Equipment | Test Equipment

X-6600 X-Ray Images Machine for Semiconductor, Packing components for Semiconductor, Packing components A Leader in the Intelligent x-ray Detection Equipment Application Field LED, SMT, BGA, CSP, Flip Chip Inspection Semiconductor, Packing compon

Seamark zm Tech Group

Seamark zm X-6600 X-Ray Images Machine for Semiconductor, Packing components

Seamark zm X-6600 X-Ray Images Machine for Semiconductor, Packing components

New Equipment | Test Equipment

X-6600 X-Ray Images Machine for Semiconductor, Packing components for Semiconductor, Packing components A Leader in the Intelligent x-ray Detection Equipment Application Field LED, SMT, BGA, CSP, Flip Chip Inspection Semiconductor, Packing compon

Seamark zm Tech Group

SMT BGA solder inspection equipment Seamark Zhuomao X-6600 for detects inspection

SMT BGA solder inspection equipment Seamark Zhuomao X-6600 for detects inspection

New Equipment | Inspection

We provide X-ray inspection and BGA repairing solution, welcome to contact Rita Li by: whatsapp/wechat:0086 134 3448 1030 Skype:ritaleeli Email:ritaleeli0809@gmail.com SMT BGA solder inspection equipment Seamark Zhuomao X-6600 for detects inspe

Seamark Zhuomao Photoeletric technology(Shenzhen)CO., ltd

Nordson DAGE and Rockwell Collins Co-author Technical Paper on Voiding in Ball Grid Arrays

Industry News | 2011-09-23 22:09:26.0

Nordson DAGE announces that a Technical Paper entitled "The Last Will and Testament of the BGA Void" will be presented at the SMTA International Conference & Exhibition.

Nordson DAGE

TV back light led strip X-ray inspection machine X-1200 for soldering inspection

TV back light led strip X-ray inspection machine X-1200 for soldering inspection

New Equipment | Inspection

Seamark provide inspection and repairing solution for SMT/electronics, such as X-ray counter ,X-ray inspection machine and BGA rework station. For more information, please contact Rita Li by: whatsapp/wechat:0086 134 3448 1030 Skype:ritaleeli Ema

Seamark Zhuomao Photoeletric technology(Shenzhen)CO., ltd

X-eye 6200 - In-Line 2D AXI / WAXI

X-eye 6200 - In-Line 2D AXI / WAXI

New Equipment | Inspection

In-Line X-ray Inspection System Automatically in-line inspect Solder joint defects of PCBA and other defects on Hidden Components. Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently. Performing X-r

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