Industry News | 2013-01-15 11:02:53.0
VJ Electronix, Inc. will display its new Vertex II next-generation X-ray technology and fully configured SRT Micra Rework Platform in Booth #333 at the upcoming IPC APEX Expo
Industry News | 2013-03-18 16:59:53.0
VJ Electronix, Inc., will display its new Vertex II next-generation X-ray technology and the high-performance SRT Micra Rework Platform in Stand #7-233 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Industry News | 2013-03-27 16:44:31.0
VJ Electronix, Inc., will display its new Vertex II next-generation X-ray technology and the high-performance SRT Micra rework platform in the Kasion Booth (1G56) at the NEPCON China 2013 exhibition and conference.
Industry News | 2013-07-29 13:46:48.0
VJ Electronix, Inc will display its new Vertex II next-generation X-ray technology and the high-performance SRT Micra rework platform in the Kasion Booth 1H43 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China.
Shenzhen Zhuomao Technology Co., Ltd. Specialized in BGA/SMT Rework, Reballing, SMD LED (LED Display Module) Repair, TV LCD Laser Repair, X-Ray Inspection Machine Since 2005. We design and development of customized Non-standard BGA Rework System in
Industry News | 2014-08-28 15:48:58.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Dr. Evstatin Krastev, Director of Applications, will present two papers at the upcoming SMTA International exhibition.
Industry News | 2010-09-29 23:32:58.0
Christopher Associates/Koki Solder announce that Jasbir Bath will present a paper titled “An Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes to Reduce Voiding in Large Contact Area Power Transistor/QFN Type Components” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2021-07-19 16:39:47.0
As today's board complexity increases with more components and joints, higher density, and shrinking package technologies, X-ray inspection is integral to identify manufacturing errors. Understanding the significance of this process, Altus continues to add to its equipment offering with the most advanced inspection systems like X-Spection 6000 which has led to new business.
Industry News | 2021-07-22 15:02:11.0
As today's board complexity increases with more components and joints, higher density, and shrinking package technologies, X-ray inspection is integral to identify manufacturing errors. Understanding the significance of this process, Altus continues to add to its equipment offering with the most advanced inspection systems like X-Spection 6000 which has led to new business.
Technical Library | 2017-06-22 17:11:53.0
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “air gaps” such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. For comparison, representative x-ray images of the assemblies were also gathered to show key defect detection features of the two non-destructive techniques.
