Full Site - : voiding in d paks (Page 7 of 8)

Big Holes (no Pun intended) in the IPC610D Criteria for Shrink/t

Electronics Forum | Fri Feb 17 13:10:34 EST 2006 | amol_kane

I have Immersion Ag and Immersion Sn LF boards that were waved using SAC305 alloy. I have a lot of tears/shrink voids in the waved connections. I am aware that SAC305 in wave has a propensity of shrink tears/voids due to the non eutectic property of

How to Differentiate Class 3 and Class 2 products in terms of process

Electronics Forum | Mon Jan 12 21:31:26 EST 2015 | warwolf

The closer your inspection the more defects you will find, the more rework you do the possible cost you will add and the potential increase of damage you could do to your products if rework is not up to a machine copyable standard. "Is there any in

VOIDS on Solder joint (backside of D2PAK heatsink)

Electronics Forum | Fri Sep 01 03:06:20 EDT 2000 | Adelina Baggayan

Hi!, Can anyone help me with problems with Solder voids after reflow curing on D2PAK heatsinks? I would like to remove the gas from the solder paste; can centrifuge help?How many minutes should a solder paste in a tube be processed in a softener? Ho

Voids

Electronics Forum | Fri Dec 03 13:29:39 EST 2004 | cyber_wolf

Voids are quite common. You just need to make sure that it is not excessive per your assembly criteria. Take a look at a D-pak under X-ray.

Solder Voids

Electronics Forum | Mon Aug 18 17:15:15 EDT 2008 | jlawson

This can be seen on leaded soldering also as well as LF (worse with LF). To reduce this you can look at your stencil and profile. Printing a cross-hatch deposit can reduce the voiding as it allow gasses to release when in reflow - thats the theory

D-pak end joint wetting

Electronics Forum | Sun Apr 19 12:54:39 EDT 2020 | davef

A-620G doesn't require 100% wetting to the thermal pad. It requires 100% wetting to the land in the end-joint area. The end joint is the portion of the solder connection that is at the top [or bottom] of the connection. Look at 7.1.3 Solder Joint A

Criteria for thermocouple wire attachment

Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack

Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal


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