Industry Directory | Manufacturer
Shuttle Star Technology designs and builds advanced off-line 2.5D&3D x-ray inspection systems for solder joint and final assembly test inspection in SMT&EMS. It uses world-class X-ray techniques with advanced defect detection.
Industry Directory | Manufacturer
Scienscope supplies inspection equipment, including stereo zoom microscopes, video an X-Ray inspection equipment, automated optical inspection systems, magnifiers, measurement systems.
Vacuum SMT Reflow Oven KC-Z104 PCB: 400mm*350mm 10 heating zones Weight APPROX:2500KG Dimension L6025×1350×1500mm Product description: Vacuum SMT Reflow Oven KC-Z104,China factory manufacturer directly. PCB: 400mm*350mm, 10 heating
Inline 3D PCB Automated X-ray Inspection System - Advanced Quality Assurance Solution ❙ Introduce of SMT PCBA X-ray Machine Explore our Inline 3D PCB Automated X-ray Inspection System, a cutting-edge solution for advanced quality assurance in PCB
Industry News | 2018-10-18 09:16:42.0
New Technology for Void-free Reflow Soldering
Industry News | 2022-10-13 07:44:15.0
I.C.T SMT Vacuum Reflow Oven Machine helps you to solve the problem of High Solder Voids Rates
Technical Library | 2017-11-15 22:49:14.0
While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement, voiding at any level severely compromises thermal conductivity. For example, in LED lighting modules effective conduction of heat through the 1st level die attach to the substrate and then through the 2nd level attach to the heat sink is critical to performance so that voiding in the solder joints at both levels must be minimized. (...) In this paper, the authors will review the factors that influence the incidence of voids in small and large area solder joints that simulate, respectively, the 1st and 2nd level joints in LED modules and discuss mitigation strategies appropriate to each level. They will also report the results of a study on the effect on the incidence of voids of flux medium formulation and the optimization of the thermal profile to ensure that most of the volatiles are released early in the reflow process.
Technical Library | 2016-05-12 16:29:40.0
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multiple HDI layers. Stacked microvias are usually filled with electroplated copper. Challenges for fabricating reliable microvias include creating strong interface between the base of the microvia and the target pad, and generating no voids in the electrodeposited copper structures. Interface delamination is the most common microvia failure due to inferior quality of electroless copper, while microvia fatigue life can be reduced by over 90% as a result of large voids, according to the authors’ finite element analysis and fatigue life prediction. This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
Inline 3D PCB Automated X-ray Inspection System - Advanced Quality Assurance Solution ❙ Introduce of SMT PCBA X-ray Machine Explore our Inline 3D PCB Automated X-ray Inspection System, a cutting-edge solution for advanced quality assurance in PCB
Events Calendar | Tue May 30 18:30:00 UTC 2023 - Tue May 30 18:30:00 UTC 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | Georgetown, Penang | Engineering
Philips Lumileds Lighting Sdn. Bhd Position Title : SMT Engineer Specialization : Manufacturing/Production Operations Industry : Electrical & Electronics Duration : May 2006 - Present Work Description: To conduct NPI & all SMT related process in Lu
SMTnet Express, December 16, 2017, Subscribers: 31,015, Companies: 10,789, Users: 24,054 Controlling Voiding Mechanisms in the Reflow Soldering Process Keith Sweatman, Takatoshi Nishimura, Kenichiro Sugimoto, Akira Kita; Nihon Superior Co., Ltd
| http://etasmt.com/cc?ID=te_news_bulletin,23564&url=_print
A Pressure Curing Oven , or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined
