Industry Directory | Manufacturer
Shuttle Star Technology designs and builds advanced off-line 2.5D&3D x-ray inspection systems for solder joint and final assembly test inspection in SMT&EMS. It uses world-class X-ray techniques with advanced defect detection.
New Equipment | Fabrication Services
Base Material: FR4 Layer count: 4 layer Board thickness: 1.6mm Copper Thickness:1 oz Surface finish: nickel gold plating Soldermask Colors: Green Size:159.25*182/1up
8-layer PCB with impedance control. Surface Finish: Immersion Gold
Electronics Forum | Thu Oct 25 13:33:18 EDT 2012 | cyber_wolf
Ken, The photo looks like results I have seen because the gold flash was too thick on the board. This causes a condition known as gold imbrittlement. You may want to get an analysis of the plating thickness. I'm not real experienced with immersion si
Electronics Forum | Sun Apr 24 09:12:00 EDT 2005 | davef
We're not sure what your customer is talking about either. Gold and tin form an intermetallic compound [IMC] that can cause poor solder connections. To minimize the potential of a problem, keep gold to less than 3 percent of the metal. [Search the
Industry News | 2021-01-06 17:17:19.0
The SMTA Capital Chapter is excited to host the first chapter webinar of 2021 on January20that11:00 AM EST.Fred Dimock, BTU International, will be presenting "Operation of a Vacuum Reflow Oven with Updated Void Reduction Data."
Industry News | 2016-09-14 17:44:33.0
IPC – Association Connecting Electronics Industries® will present “PCB Troubleshooting” on November 2, 2016 in Raleigh, N.C. in conjunction with regional trade show, PCB Carolina.
2.jpg)
Parts & Supplies | Assembly Accessories
SIEMENS Original Used A1D00352957-04 6s-Sleeve with ball fixing compl. More Siemens feeder available Siemens Feeder 2x8mm FEEDER 141096 Siemens Feeder 3x8mm Gold FEEDER 141099 Siemens Feeder 3x8mm Silver FEEDER 141098 Siemens Feeder 3x8mm SL FE
Technical Library | 1999-05-07 11:28:39.0
There are many things that can go wrong when soldering to gold plate over nickel surfaces. First of all, we know that gold and solder are not good friends, as any time solder comes into contact with gold, something seems to go wrong. Either the solder bonds to the gold and eventually pulls off as the tin and gold cross-migrate, leaving voids; or the solder completely removes the gold and is expected to bond to the metal which was under the gold.
Technical Library | 2021-04-21 19:28:30.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ASSCON’s vacuum soldering process combines the average of the vapor-phase with the vaccum process. The vaccum module consists of the evacuation unit mounted in the process chamber where it is secured with quick-locks for fast and easy removal f
Events Calendar | Thu Jan 10 00:00:00 EST 2019 - Thu Jan 10 00:00:00 EST 2019 | Manassas, Virginia USA
SMTA Capital Chapter: Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder
Voiding Control for QFN Assembly Voiding Control for QFN Assembly Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
]. Planar microvoiding however, is a specialized case of voiding most often associated with surface finish issues or surface contamination
| https://www.hitachi-feeder.com/sale-9371931-universal-instrument-24mm-hp-gold-plus-with-spliceable-tape-feeder-p-n-50935003-50935004.html
Universal instrument 24mm Hp Gold plus with spliceable tape feeder P/N:50935003/50935004 WELCOME TO SHENZHEN ZHI HONGLAI TRADING CO.,LTD Sales
.gif)
