New Equipment | Solder Materials
V9 No Clean solder paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction achievable on all surface finishes including ENIG, ImSn and OSP. V9 exhibits stable print performance on fine feature
New Equipment | Solder Materials
NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC
Electronics Forum | Tue Feb 19 23:00:29 EST 2008 | amarpreet41
Connector pin - 10.83 mils Hole dia - 27 - 33 mils. We are trying to find the optimam level for hole dia.
Electronics Forum | Tue Mar 06 14:10:52 EST 2001 | CAL
Are the voids in the balls of a BGA? Are you verifying this through x-ray if they are? some voids depending on size and location are some what accepted. Solder paste type? Solder paste date code? Humidity high? PCB's been stored in a truck trailer?
Industry News | 2018-10-18 09:29:21.0
Wave soldering welding interview direct contact with high temperature liquid in the production
Industry News | 2018-10-18 08:34:52.0
How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?
Technical Library | 2023-11-14 19:24:08.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
SMT Semi Auto Screen Printer for pcb size 1200 in smt LED production line Product introduction: 1.Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. 2.Printing scraper can rotate 45
Semi-automated, programmable X-ray inspection system with multi-axis for prototyping, failure analysis, manufacturing process validation and rework verification for PCBs up to 18 x 20". The XT-3 is a high quality high-resolution manual x-ray inspecti
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Events Calendar | Thu Oct 28 00:00:00 EDT 2021 - Thu Oct 28 00:00:00 EDT 2021 | ,
Juarez Chapter Webinar: Pin in Paste
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
| https://www.eptac.com/blog/are-voids-in-solder-joints-really-an-issue
Are Voids in Solder Joints Really an Issue? Looking for solder training standards, manuals, kits, and more? Visit soldertraining.com Training Training Materials Locations Resources Ask Helena
| http://etasmt.com:9060/te_news_industry/2021-08-31/23962.chtml
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