Industry Directory | Equipment Dealer / Broker / Auctions
We are a global electronics manufacturing Solutions provider ....Our company supplies new and used SMT equipment, spare parts, consumibles, ESD supplies and services to a wide range of EMS companies.
We offer a range of integrated and standalone solutions customized to unlock and optimize unrecognized value through valuation, disposition, lending or investing.
New Equipment | Board Handling - Conveyors
product instruction ※ Easy to operate touch screen control interface ※Telescopic structure, width adjustable, easy to walk ※ Photoelectric sensors with protection, more secure ※ Smooth and parallel width adjustment (lead screw) ※SMEMA port is c
New Equipment | Board Handling - Conveyors
product instruction ※ Easy to operate touch screen control interface ※Telescopic structure, width adjustable, easy to walk ※ Photoelectric sensors with protection, more secure ※ Smooth and parallel width adjustment (lead screw) ※SMEMA port is c
Electronics Forum | Wed Dec 17 08:47:18 EST 2014 | cloughley
What are the added capabilites going from 7w to 20w, 355nm YAG laser I wanted to know what the added capabilities we now have are going from a 7w to 20w, 355nm YAG laser. Currently we support the following materials: http://www.bestlaser.net/mater
Electronics Forum | Thu Apr 21 06:05:48 EDT 2022 | sophyluo1985
Hi，Dear All，Recently we have many customers asking us, FUJI NXTIII pick and place machine can use W08c feeder or W08f feeder, which one is better? We know the W08c will cost less than the W08f feeder. But there will still be some people who will be c
Used SMT Equipment | Pick and Place/Feeders
Make: Siemens Model: Siplace 80 FS w/WPW 80F3 ES01 Description: Pick and Place Machine w/tower Vintage: 1999 (tower 1996) Software Version: 407.05 Condition: Complete & Operational Location: USA Shipping: EXW Origin Price: 100% Prepay Ad
Used SMT Equipment | Soldering - Wave
This machine will be coming available for purchase. Our end-user customer does not have a set price for this item. They have told us to forward them all offers. Please contact ashlin@bajabid.com for more information. Features: Version V4.6
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Industry News | 2003-03-06 08:10:20.0
Astec Power has expanded its popular APC-Centauri surface-mount product line to include a series of 40W point-of-load DC/DC convertors.
Parts & Supplies | Pick and Place/Feeders
For those of you in need of #Mydata Agilis Feeders and/or magazines, make sure you check out this online auction ASAP. https://lnkd.in/e4ZkS5hW
Parts & Supplies | Pick and Place/Feeders
Fuji NXT SMT FEEDER Specs: Standard: W12C/W16C/W24C Brand: FUJI Introduce: We can supply FUJI NXT/NXT II/NXT III/XPF/AIMEX feeders: 4MM W04b / W04f 8MM W08 / W08b / W08c / W08f / W08n 12MM W12 / W12c 16MM
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
i4.0 Today caught up with Marc Peo of Heller Industries at IPC Apex Expo in San Diego, to discuss the IPC CFX initiative. Check out the rest of the CFX Videos from IPC APEX EXPO 2018 here: CFX Highlights: https://youtu.be/Q7_fWK7_zeA IPC Representati
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Jun 25 00:00:00 EDT 2024 - Tue Jun 25 00:00:00 EDT 2024 | Milwaukee, Wisconsin USA
Wisconsin Chapter In-Person Technical Meeting: Manufacturing by Design is the new DFM
Events Calendar | Tue Jun 11 00:00:00 EDT 2024 - Tue Jun 11 00:00:00 EDT 2024 | Vaughan, Ontario Canada
Ontario Expo & Tech Forum
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: 5+ years of test design at the component, sub assembly, assembly and system level. ATE design, test software using Labview, optical and/or RF communications is preferred, OWDM,DC-48/192 highly desired. Duties/Functions: Takes le
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BSME (will take someone w/Lots of experience). Loss gas recycle experience (EGR), component system level experience, board regulators, exhaust systems experience, prior design experience. Duties/Functions: Work with design team
Career Center | Noida, India | Engineering
I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e
Career Center | Noida, India | Engineering
I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters/4600-w
4600-W Automated BondTester X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_mandw_chiller.html
M n W Chiller M and W Flowrite Chiller M and W Flowrite Recirculating Cooling System Model Number: RPCX17A-D-D12x10"-LI-CMII-HE Serial Number
