Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Nano-copper sintering in formic acid vapor.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Industry News | 2021-06-26 09:04:13.0
Whizz Systems, Inc. today announced the addition of a Powersonic™ Benchtop Ultrasonic Cleaner from Crest Ultrasonics.
Industry News | 2003-01-27 10:27:31.0
At a New Facility Within the Company's U.S. Headquarters
Industry News | 2002-03-29 08:28:28.0
Has Found a Buyer for its Wafer Fabrication Facility in Plymouth, England
Industry News | 2013-08-07 11:18:17.0
MIRTEC recently announced that Brian D'Amico has been appointed President of MIRTEC’s Industrial Camera Division, ISVI Corporation.
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
4 Vreeland Rd.
Florham Park, NJ USA
Phone: 973-377-6800
