Industry Directory | Manufacturer's Representative
ASE is contract IC assembly and test manufacturer situated in Penang Malaysia. Establishing wafer bumping capability is one of key program for year 2001 which I am given the task to start and establish. I am in search of any relevant technical papers, studies, technical bulletin to wafer bumping.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
DEK Galaxy SMT Stencil Printer Maximum printing surface： 510 mm* (X) x 508.5 mm (Y)Printing speed: 2 mm/sec to 300 mm/secWeight: Approx. 680 kgProduct description: DEK Galaxy SMT Stencil Printer, Maximum printing surface： 510 mm* (X) x 508.5 mm (Y),
Electronics Forum | Tue Jul 15 21:04:17 EDT 2003 | Thomas
It is for an evaluation run for wafer bumping....Well guys any recommendation for the profile ??
Electronics Forum | Mon Sep 28 12:55:37 EDT 1998 | Manish Ranjan
Hi Everyone Does anyone has any insight regarding the void formation in the solderbumps during wafer bumping by electroplating. Someone told me that it could be mainly coz of the alloy concentration being incorrect. Any suggestions, corrective action
Used SMT Equipment | AOI / Automated Optical Inspection
3D Wafer Bump &Wire Bonding AOI Inspection system Highest quality 3D Wire-Inspection. With high-resolution, complete inspection is possible even for Foot-shape. Inspect Mirror-surface without Reflection problem. As for PEMTRON'S unique optical techn
Used SMT Equipment | Chipshooters / Chip Mounters
Dear All , We currently have 3 units YSH20 available in our stock, if you have any interesting, please contact me. Applicable PCB L50 x W30 to L250 x W200mm ****Up to L340 x W340mm" is applicable. Please contact us separately. Mounting c
Industry News | 2003-01-27 10:27:31.0
At a New Facility Within the Company's U.S. Headquarters
Industry News | 2016-06-19 19:44:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Keynote Presenters for the 13th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Parts & Supplies | Board Cleaners
LOT OF 4, UNDER SCREEN CLEANING FABRIC Screen cleaning Rolls are essential components in keeping stencil printing machines clean and effective. Individual manufacturers configure their systems differently to use specific sizes and designs of unde
Technical Library | 2018-11-14 21:43:14.0
Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended. Finally, the competition on flip chip technology will be briefly mentioned.
Technical Library | 2007-12-06 11:37:15.0
Over the past 30 years we have learned that lead has negative affects on the health of humans and seen strong legislation remove it from gasoline and paints. More recently, governments in Europe and Asia have set deadlines to remove lead from consumer electronic devices that use printed circuit boards. Currently, the ban is not being applied to high reliability applications such as military or medical devices, but we all know that will come someday soon. Likewise many believe that lead free solder is coming to wafer bump reflow and are beginning to make the transition.
Nano-copper sintering in formic acid vapor.
The first technology to use centrifugal energy to clean electronic circuit assemblies, precision parts, and semiconductor packages. The system offers unparalleled penetration, solubilization, and contaminant removal The MicroCel Centrifugal Cleanin
Events Calendar | Wed Aug 16 00:00:00 EDT 2017 - Sat Aug 19 00:00:00 EDT 2017 | Harbin, China
ICEPT 2017, The 18th International Conference on Electronic Packaging Technology
Lead-Free Solder Wafer Bumping Lead-Free Solder Wafer Bumping Over the past 30 years we have learned that lead has negative affects on the health of humans and seen strong legislation remove it from gasoline and paints. More recently, governments
Surface Mount Technology Association (SMTA) | https://www.smta.org/southeast-asia/keynotes.cfm
., ASM Pacific Technology Recent advances in (1) flip chip such as wafer bumping, package substrate, assembly, and underfill, (2) fan-in WLCSP (wafer-level chip scale package
| http://etasmt.com/cc?ID=te_news_bulletin,23566&url=_print
(including toxic gases). Formic Acid has been shown to be an effective reducing agent in fluxless solder reflow Excellent results demonstrated for wafer bumping application in horizontal reflow oven Fluxless reflow utilizes
