Industry News | 2023-07-22 07:29:05.0
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The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under computer control with p
Industry Directory | Manufacturer
Keteca USA manufactures dicing saw blades and dicing surfactants in its Arizona factory. We offer best performance and pricing and have much experience in ceramics, III-V materials and Si. quick turn arounds and USA made.
Parts & Supplies | Repair/Rework
We are providing below ceramic chuck table products/services · New, and refurbished, porous ceramic chucks for Disco ,ADT, K&S ,Applied materials saws. · 4",6",8,",12" regular size available in round , square ,oval shape or irregular shapes and si
Parts & Supplies | Repair/Rework
We are providing below ceramic chuck table products/services · New, and refurbished, porous ceramic chucks for Disco ,ADT, K&S ,Applied materials saws. · 4",6",8,",12" regular size available in round , square ,oval shape or irregular shapes and si
APD DEVELOPS creative solutions to challenging micro machining problems, using precision diamond dicing blades and lasers to cut and machine a variety of hard brittle materials.
NGA provides Micro Automation Dicing Saw Sales, Refurbishing, Service,Parts, Air Bearing Spindle rebuilding, Board stuffing and repair and Custom wafer dicing
Heat-activated, anti-static cover tapes for component packaging offer superior bond performance, resistivity and adhesive integrity. WAFERTAPE products for wafer mounting, dicing and backgrinding insure consistent, precise, repeatable wafer yields.
Optical polishing, edge polishing, dicing, flat lapping and machining of all hard materials including ceramic substrates, quartz, AlN, glass and sapphire windows, silicon wafers and very thin substrates and windows.
Industry Directory | Manufacturer
Majelac Technologies offers quick turn IC assembly services, including open cavity QFN, wafer dicing, die sorting, wire bonding, BGA reballing, BGA assy, prototype assembly, fine pitch wire bonding, and more,
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