Our leading products are researched, developed and manufactured at Keteca USA, in Phoenix Arizona. Solution to bonding problem? Keteca Diamaflow is the Answer! The Sub-Micron Technology of today and the future requires continued improved methods to
Syagrus Systems uses the 3M Wafer Support System to meet the demands of today's technology companies for extremely thin silicon wafers and die used in complex applications. We have over 15 years of silicon wafer thinning and wafer backgrinding experi
Syagrus Systems has a long history in providing superior wafer and die visual inspection services to the semiconductor industry. Syagrus Systems features fully automated wafer inspection systems as well as the flexibility of manual wafer inspection
Industry News | 2017-03-08 19:49:16.0
ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has won an order for its Mosaic Plasma Dicing System from JCAP Corporation (Jiangyin Changdian Advanced Packaging Co., Ltd), a JCET company and leading Chinese advanced packaging services provider to global semiconductor companies. Orbotech's SPTS also announced that a recent analysis of MEMS microphones in the iPhone 7 Plus conducted by System Plus Consulting[1] confirmed that an ASIC device in the iPhone 7 Plus had been plasma diced.
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Porous ceramic vacuum chuck table or Polishing Chuck table supplied to semiconductor industry for silicon wafer dicing or finishing purposes. This product is an uniform compact frame, high strength, g
To compliment our wafer dicing and inspection processes, Syagrus Systems offers fully automated die sorting services. Whether you require high volume production or a single wafer prototype build, Syagrus Systems has the die sorting solution for you.
Industry News | 2013-11-18 16:42:52.0
Microtronic GmbH has entered into a strategic partnership with Loadpoint to offer a dicing and grinding service.
NEPTCO�s WAFERTAPE family of products for wafer mounting, dicing and backgrinding is designed to insure consistent, precise, and repeatable wafer production yields. NEPTCO's superior coating technology encompasses Total Thickness Variation (TTV) co
Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela
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