Industry News | 2013-06-20 19:12:14.0
Tresky, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.
Used SMT Equipment | Pick and Place/Feeders
Opal XII machine in top condition. Incl. 8x SF head 2x vision Camera's Others: Optimal output per hour: 11,6k IPC 9850 output per hour: 9,6k Head design with SF: one single beam with 8 super fine heads Placing accuracy at #24; sigma: 5
The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
Industry News | 2018-09-19 21:40:32.0
VJ Electronix,will exhibit in Booth #1210 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will demonstrate its industry-leading XQuik II with AccuCount Technology.
Industry News | 2023-11-13 12:31:47.0
Circuit Technology Center announces it has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. They can also propose a trim and lead-form drawing if needed. Dedicated, custom tooling can be fabricated to meet custom package requirements.
Industry News | 2013-01-12 12:27:34.0
With its new SIPLACE Very-High-Force Head for odd-shaped components, ASM Assembly Systems is adding another major option for its SIPLACE SX placement machines. The new Very-High-Force Head is able to place components up to 30 millimeters high and 200 millimeters long with a force of up to 70 newtons. That way, users can process on their SMT line even extremely large components with snap-in or through-the-hole fasteners such as connector modules for automotive or IT applications.
Industry News | 2012-02-09 22:04:13.0
Europlacer will demo its award-winning iineo II and XPii-II SMT pick-and-place platforms in booth number 3015 at APEX 2012.
Industry News | 2012-07-06 19:44:05.0
Carlsbad, CA– July 6, 2012: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the Ultra 850G Microelectronics and Packaging AOI solution at the Semicon West 2012 exhibition. The exhibition is at the Moscone Center in San Francisco from July 10-12 2012. Machine Vision Products are exhibiting at booth #6383 in the North Hall.
Industry News | 2012-07-06 19:44:24.0
Carlsbad, CA– July 6, 2012: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the Ultra 850G Microelectronics and Packaging AOI solution at the Semicon West 2012 exhibition. The exhibition is at the Moscone Center in San Francisco from July 10-12 2012. Machine Vision Products are exhibiting at booth #6383 in the North Hall.
