Full Site - : waffle pack (Page 8 of 9)

Esec Micron2 vs. RD Automation CDB-50

Electronics Forum | Fri Dec 10 18:02:45 EST 2004 | Sam El.

I was wondering if anyone has had any experience with either the Esec Micron 2 or the RD Automation CDB-50? We currently have a Micron 2 (1997 build). We are using it for small batches of flip chip. We use the waffle pack feeder not the wafer loader.

Die placement with MPA-G3 pick and place

Electronics Forum | Thu Jun 06 07:53:51 EDT 2002 | Jim M.

Has anyone had much luck Picking and Placing die with a Panasonic MPA-G3?What special setups or considerations are required? Currently we pick and place one die with our Universal GSM using only one nozzle. The nozzle must be painted white in order

MS Level 6

Electronics Forum | Mon Jun 25 20:32:44 EDT 2001 | davef

You�re correct. This is a messy situation. Do not store components at the bake temperature longer than the time required to dry out the units for use in the reflow. Long storage times at elevated temperatures can cause soldering problems and the

Dicing Operation

Electronics Forum | Mon Oct 19 15:37:12 EDT 1998 | Manish

Hello everybody This is kind of urgent for me. I would appreciate if anyone of you could tell me where could i find information about the different dicing techniques and operations used in the industry. I need information about the following: 1

Re: Dicing Operation

Electronics Forum | Wed Oct 21 08:16:40 EDT 1998 | Andy

| Hello everybody | | This is kind of urgent for me. I would appreciate if anyone of you could tell me where could i find information about the different dicing techniques and operations used in the industry. | | I need information about the fol

Integration of manual odd form / low volume pick and place

Electronics Forum | Wed Aug 21 18:13:21 EDT 2002 | johnlee

Kevin, There are a number of custom integrated systems that perform automated insertion of "odd" components. These system use either a robot or cantilevered X,Y,Z Cartesian motion systems. Our systems have accepted standard and custom component feede

Rating SMT Machines

Electronics Forum | Wed Oct 16 09:30:11 EDT 2002 | nwyatt

I've worked with Panasonic, Fuji, Siemens, and Universal. I cannot rate Mydata since I have no experience with them. Here are my ratings based on personal preference: 1=Siemens 2=Fuji 3=Universal 4=Panasonic My reasoning behind this is: 1) Siemens

No such thing as a Compact Reflow Oven?

Electronics Forum | Tue Mar 20 03:55:38 EDT 2018 | rob

MTC = Multi tray changer. It's a stand alone unit that feeds in trays of components - it means you don't sacrifice feeder locations to waffle packs. Different companies call them different things. A 760 is dog slow, and spares are getting harder to

Re: Baking Components ?

Electronics Forum | Fri Jul 30 17:22:48 EDT 1999 | Dave F

| | Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce so

Re: Dicing Operation

Electronics Forum | Wed Oct 28 19:45:33 EST 1998 | Ron Gilman

I will try to answer some of your questions. My name is Ron Gilman and I am President of Chipscale Robotics here in Fremont California. We manufacture Die Pick & Place equipment and would be happy to send you brochures. Please email me with your a


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