Industry News | 2016-10-04 19:28:47.0
Akrometrix today announced its next-generation Shadow Moiré System – the AXP 2.0.
New Equipment | Test Equipment
The CXP (Convection Expandable Platform) is a low cost, stand alone equipment primarily targeted at the EMS and PCB Fab Market. The CXP uses the Digital Fringe Projection technique to measure a field of view of 64x48mm with a measurement resolution o
New Equipment | Test Equipment
The AKM600P is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for wafers or panels up to 600 mm x 600 mm. With time-temperature profiling capa
Technical Library | 2011-06-09 13:29:17.0
Flatness measurement of electronic parts and assemblies, or PCB’s, has become increasingly critical as geometries become smaller: finer pitches, smaller solder ball volumes, thinner substrates, etc. Additionally, processing temperatures vary and can pla
Industry News | 2016-09-23 15:41:59.0
Akrometrix today announced that Ryan Curry, Technical Account Manager, will co-present a paper with Don Adams, Manufacturing Engineering Manager at Bose Corporation, during SMTA International. The presentation, “Understanding PCB Design and Material Warpage Challenges Which Occur during B2B/Module-Carrier Attachment,” is scheduled to take place during session APT7, “Package and PCB Interactions,” on Wednesday, September 28th at 4 p.m.
Industry News | 2017-10-16 19:34:54.0
Akrometrix will display its newest warpage metrology system in Hall A3, Stand 102/1 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München, in Germany. The new Tabletop Shadow Moiré (TTSM) system offers all of the software features of Akrometrix’s thermal warpage metrology systems in a room temperature unit which provides full field-of-view measurement in less than two seconds.
Industry News | 2016-09-22 17:49:37.0
Akrometrix today announced its upcoming schedule for technical presentations:
Built on the industry leading Pyramax platform, TrueFlat is a unique reflow oven configuration to stop substrate warpage. Designed for substrate thicknesses of 0.15 to 0.30mm, TrueFlat technology ends die tilt.
Exclusive15MP / 25MP CoaXPress Camera System Dual Projection Shadow Free Moiré Technology Precision Compound Telecentric Camera Lens Automated Z-Height Calibration System Automated PCB Under Board Support System Precision PCB Warpage Compensatio
Exclusive 15MP CoaXPress Camera System Dual Projection Shadow Free Moiré Technology Precision Compound Telecentric Camera Lens Automated Z-Height Calibration System Automated PCB Under Board Support System Precision PCB Warpage Compensation Clo
