Used SMT Equipment | Screen Printers
right, right--> left, left-> left, right--> right, pass through Conveyor configuration front or rear fix PCB transport width adjustment motorised, software controlled PCB warpage 1% of PCB diagonally, up to a max. of 11 mm including PCB thickness S
Used SMT Equipment | Screen Printers
MyData MY500 Jet Printer Vintage: 2013 Great Condition Software: JPSys 1.9.5 New MY500 2D Camera Kit (L-039-0201) Installed March 2020 SMC Air Dryer/Chiller Included 3 Cassettes Included: Lead Free, Leaded, & Adhesive Calibration Kit Inclu
Used SMT Equipment | Chipshooters / Chip Mounters
Station configuration Includes: ● Four Independent X I Y gantries with a 12 nozzle revolver head on each ● Four feeder changeover tables ● Four automatic waste tape cutters ● One five section conveyor with automatic width control ● One station c
Used SMT Equipment | Screen Printers
EKRA XACT4 Automatic Screen Printer Vintage 2013 Excellent Condition Recently Taken Offline PCB size min.: 80 x 50 mm / max.: 550 x 550 mm PCB thickness 0.5 - 6 mm PCB clearance
Technical Library | 2007-11-29 17:20:31.0
Programs have been developed to predict the expected yield of flip chip assemblies, based on substrate design and the statistics of actual manufactured boards, as well as placement machine accuracy, variations in bump sizes, and possible substrate warpage. These predictions and the trends they reveal can be used to direct changes in design so that defect levels will fall below the acceptable limits. Shapes of joints are calculated analytically, or when this is not possible, numerically by means of a public domain program called Surface Evolver. The method is illustrated with an example involving the substrate for a flip chip BGA.
Technical Library | 2021-08-11 01:00:37.0
Conformal coatings and potting materials continue to create issues for the electronics industry. This webinar will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available. Similarly, this webinar will look at the failure modes of potting materials, (e.g Glass Transition Temperature (Tg), PCB warpage, the effects of improper curing and potential methods for correcting these situations.
Industry News | 2021-07-02 04:06:41.0
Laserssel Co., LTD is pleased to introduce its rLSR Mini LED Rework System. The revolutionary soldering technique enables the industry to solder temperature sensitive, warpage prone, very fine-pitch, odd form, big die, SiP, wearables, flex to flex, and various other mainstream and niche applications defect-free, high yield and with a low cost of ownership.
Industry News | 2023-03-16 14:42:07.0
SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.
Nanovea 3D Non-Contact Profilometers are designed with leading edge optical pens using superior white light axial chromatism. Nano through macro range is obtained during measurement (Profile Dimension, Roughness Finish Texture, Shape Form Topography,
New Equipment | Selective Soldering
The Vitronics Soltec mySelective 6746 is a selective soldering automation workcell that has been optimized for maximum throughput and flexibility while minimizing its footprint in the factory. Inline processes and intuitive programming features enhan
