Industry News | 2016-09-22 17:49:37.0
Akrometrix today announced its upcoming schedule for technical presentations:
Built on the industry leading Pyramax platform, TrueFlat is a unique reflow oven configuration to stop substrate warpage. Designed for substrate thicknesses of 0.15 to 0.30mm, TrueFlat technology ends die tilt.
Exclusive15MP / 25MP CoaXPress Camera System Dual Projection Shadow Free Moiré Technology Precision Compound Telecentric Camera Lens Automated Z-Height Calibration System Automated PCB Under Board Support System Precision PCB Warpage Compensatio
Exclusive 15MP CoaXPress Camera System Dual Projection Shadow Free Moiré Technology Precision Compound Telecentric Camera Lens Automated Z-Height Calibration System Automated PCB Under Board Support System Precision PCB Warpage Compensation Clo
Industry News | 2017-01-10 10:51:05.0
Akrometrix will exhibit in Booth #704 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. The company will demonstrate its next-generation Shadow Moiré System – the AXP 2.0.
Industry News | 2016-02-25 08:45:46.0
Akrometrix today announced that it has developed an automated die-board (or daughter-mother board) attach tilt metrology. All Akrometrix shadow moiré or DFP systems (AXPs) can be upgraded with the new feature.
Technical Library | 2014-08-19 16:04:28.0
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly.
Industry News | 2015-04-07 15:42:29.0
Akrometrix will display the latest surface measurement equipment platform, the CXP, in the Microtronic Booth, #7-101L, at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg Germany.
Industry News | 2016-03-30 08:12:07.0
Akrometrix today introduced the latest generation Digital Image Correlation (DIC) module for both its AXP and PS200 platforms.
Z-500 Bottom inspection type inline AOI Machine is deal for bottom side component inspeciton, and inline wave solder inspection. With core accurate positioning technology which can deal with PCB warpage and flexible board to reduce false report. Stab
