Electronics Forum | Tue Aug 22 16:13:08 EDT 2000 | Dr. Ning-Cheng Lee
FR-4 will be OK for small products such as cellular phones. Here the temperature gradient across the board may be 3-4C only, and the board temperature can be well controlled. At temperature above around 245C, the discoloration and delamination may be
Electronics Forum | Mon Dec 31 08:59:36 EST 2001 | Don Adams
The second pass in the wave is pretty extreme and will probably aggravate the conditions which caused warpage in the first place. Areas to look for problems, The lay up of the boards at fabrication or the materials used can lead to warpage. Work wi
Electronics Forum | Tue Mar 21 07:31:54 EST 2006 | cyber_wolf
We had the exact same problem on our OMNI 10. We found that two of the rails the pin chain rides in were warped. Somehow at one point our PC lost communication with the oven and the heaters went wide open for several minutes...this is what caused th
Electronics Forum | Thu Oct 25 04:58:58 EDT 2007 | wayne_
I think the not fully melted BGA ball is the main problem. The middle of the BGA IC...the ball not fully melted....when it subjected to heat and cause PCB warpage....the partial melted joint in the middle part of the BGA started to crack...bcos of we
Electronics Forum | Fri May 04 18:27:34 EDT 2001 | chpark
BGA warpage combined with PCB warpage can lead significant process yield loss. First, it is possible that major portion of BGA's apparent warpage is, in fact, coming from the PCB warpage. Assuming that the warpage is solely from BGA itself, I think
Electronics Forum | Wed Sep 08 15:16:50 EDT 1999 | Jason Gregory
| | | Hello: | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting into the ov
Electronics Forum | Wed Sep 08 17:34:26 EDT 1999 | Earl Moon
| | | | Hello: | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting into th
Electronics Forum | Wed Sep 08 20:26:30 EDT 1999 | Jackie Hsieh
| | | | | Hello: | | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting int
Electronics Forum | Thu Aug 17 08:44:14 EDT 2000 | Wolfgang Busko
Hi Jaqueline, my first thought goes into the same direction, twist or warp (either the board or the BGA itself). I don�t know the SRT equipment. I�ve noticed with our equipment using a spot underheat element caused some warpage of the PCB making it
Electronics Forum | Tue Apr 29 10:37:58 EDT 2008 | cokedigits
Dedrites cause this to happen.
