Electronics Forum | Fri Jun 29 23:10:02 EDT 2001 | Danial
Thanx for the reply guys!! The problem happened on only one PBGA, the balls are eutectic and the paste volume height is at 5.96 mil min. The stencil opening has been increased to 30 mil which initially was 20 mil. You guys are right!! One probable
Electronics Forum | Sun Apr 03 10:07:40 EDT 2005 | davef
In 2001, IVF evaluated the reliability of IBM CBGA and CCGA, i.e. packages with "hard" balls and columns, in space applications for the European Space Agency. One clear result was that amount of solder paste printed on the solder lands is very critic
Electronics Forum | Fri Mar 10 12:12:55 EST 2000 | Russ
Casey, I will start with the lack of thermo-couple control - The unit I have is based on time and temp. exclusively. What happens when a cold board gets reworked vs. a hot board? No bottom side preheat, the heating is very localized to topside a
Electronics Forum | Fri Mar 10 12:12:55 EST 2000 | Russ
Casey, I will start with the lack of thermo-couple control - The unit I have is based on time and temp. exclusively. What happens when a cold board gets reworked vs. a hot board? No bottom side preheat, the heating is very localized to topside a
Electronics Forum | Fri Jul 20 10:44:56 EDT 2007 | gmoritz
If you bought it from an equipment dealer ... OK, the dealer has come through and is (allegedly) sending a full compliment of documentation to arrive by Monday. > ... they need weekly maintenance ... > ... you WILL need parts for it. ... > Do you
Electronics Forum | Mon Jul 23 10:09:32 EDT 2007 | slthomas
(1) part standoff - how far the base of the part rests from the top of the board. Seating plane will rest flush with the board, whether it's the bottom of the part or a lead form. (2) lead length - is the final length of the lead adjustable, so t
Electronics Forum | Fri Sep 14 01:43:36 EDT 2001 | dhanashekar
please check the following also. in one of the cases we came across the second point was the problem. 1. the parallelisum of the conveyor. 2. the warpage of the board. 3. the stencil.(the differential height in the paste deposition of the two pads
Electronics Forum | Mon Sep 23 02:10:18 EDT 2019 | sssamw
It would kill the component on the opposite side, be careful to bent a PCB especially with component installed. Be sure the bent warpage is no higher than the component permitted or not high to cause de-lamination.
Electronics Forum | Mon Jun 14 07:23:42 EDT 1999 | Vinesh Gandhi
We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centre to
Electronics Forum | Mon Nov 26 22:05:34 EST 2007 | shy
currently i'm open my stencil aperture is 80% from the land pattern. is this will cause insufficient solder at the terminal component or not? the stencil thichness is 6mil and the board run using SMT pallet which i consider there will be no option f
