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Koh Young Technology Inc. - KSMART Warp

Koh Young Technology Inc. - KSMART Warp

Videos

KSMART Warp for Koh Young Technology’s 3D SPI automatically compensates for PCB warp in real time during inspection, using CAD information or learned PCB geometry prior to inspection. The KSMART Warp functionality for 3D SPI systems now applies to a

Technical Resources Corporation

Koh Young Zenith LiTE

Koh Young Zenith LiTE

Used SMT Equipment | AOI / Automated Optical Inspection

Features Wide Range of Measurement. Uses patented 4-way projection technology and multi-frequency height measurement, LiTE provides a wide range of measurement while maintaining high resolution. Warp Compensation. Compensates FPCB warp in realtim

Dongguan Widen Industrial Co., Ltd

Haosen International Logistics Co.,Ltd

Industry Directory | Manufacturer

Importing agency service 1. Importing used SMT machines contains SANYO FUJI JUKI UNIVERSAL PANNASERT KME YAMAHA and AI machines like PANASONIC UNIVERSAL TDK DYNAPERT.2��Importing used textile machines like warp knitting machines 3��Importing metals like copper and aluminums 4��Importing leathers and cotton yarn 5��Importing used trucks like CAT, VOLVO

A Novel Epoxy Flux On Solder Paste For Assembling Thermally Warped POP

Technical Library | 2017-08-17 12:23:27.0

A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step for BGAs or CSPs, which exhibit high thermal warpage, to form a high-reliability assembly. Requirements in drop test, thermal cycling test (TCT), and SIR are all met by this epoxy flux, EF-A. The high viscosity stability at ambient temperature is another critical element in building a robust and userfriendly epoxy flux system. EF-A can be deposited with dipping, dispensing, and jetting. Its 75°C Tg facilitates good reworkability and minimizes the adverse impact of unfilled underfill material on TCT of BGA assemblies.

Indium Corporation

Masach Tech

Industry Directory | Consultant / Service Provider / Manufacturer / Other

Masach Tech specializes in board level EMI/RFI shielding design and production. Founded in 1994, Masach is a globally recognized and leading supplier of some of the world’s largest electronic companies, driven by highest quality..

ESD lab coat (T/C Grid Anti-static Fabric)

ESD lab coat (T/C Grid Anti-static Fabric)

New Equipment | Education/Training

Single color blue and white, 5mm white grid is available. High quality Best price Static dissipative (ESD) Coat for use in EPA (Electrostatic Discharge Protected Area) Easy snap fastening (hidden Nickel free snaps) One breast pocket Two hip pocket

Hefei Bajin Trading Co., Ltd.

Printed Circuit Cards and Modeling System Effects

Events Calendar | Thu Nov 15 00:00:00 EST 2018 - Thu Nov 15 00:00:00 EST 2018 | ,

Printed Circuit Cards and Modeling System Effects

DfR Solutions

PRIME - 3D Post Reflow Bump Inspection System

PRIME - 3D Post Reflow Bump Inspection System

New Equipment | Inspection

High-spec & Performance 3D Post Reflow Bump Inspection System Highly Reliable and Accurate Inspection System No Shadow Effect & No Specular Problem Capable of Co-Planarity / PCB Warp Inspection

Koh Young America, Inc.

Universal Instruments GSM 2 Dual Beam Flex Jet 7

Universal Instruments GSM 2 Dual Beam Flex Jet 7

Used SMT Equipment | Pick and Place/Feeders

REDUCED PRICE OR BEST OFFER!  CLEANING OUT THE WAREHOUSE.  MUST SELL! We have a used GSM 2 dual beam Flex Jet 7 We are currently using the beam 2 head. Only 6 spindles currently being used (spindle 5 is slightly bent we opted not to u

AC Electronics

Low Temperature Soldering Using SN-BI Alloys

Technical Library | 2020-04-01 23:32:29.0

Low temperature solder alloys are preferred for the assembly of temperature-sensitive components and substrates. The alloys in this category are required to reflow between 170 and 200oC soldering temperatures. Lower soldering temperatures result in lower thermal stresses and defects, such as warping during assembly, and permit use of lower cost substrates. Sn-Bi alloys have lower melting temperatures, but some of its performance drawbacks can be seen as deterrent for its use in electronics devices.Here we show that non-eutectic Sn-Bi alloys can be used to improve these properties and further align them with the electronics industry specific needs. The physical properties and drop shock performance of various alloys are evaluated, and their results are analysed in terms of the alloy composition, including Bi content and alloying additions.

Alpha Assembly Solutions


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