Industry News | 2016-02-18 19:59:51.0
Akrometrix will exhibit at the SMTA Houston & Dallas Expo & Tech Forums in Texas. SMTA Houston is scheduled to take place Tuesday, March 1, 2016 at the Stafford Centre and SMTA Dallas is scheduled to take place Thursday, March 3, 2016 at the Plano Centre. The PAC Global team will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. PAC Global also will demonstrate the new Akrometrix Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.
MB-Mfg's pallet in use.
This unique full process carrier can run thru screen printing, pick & place, reflow soldering, vision inspection and X-ray inspection. The PCB can be set to the center on the y axis and flush too slightly above the top surface of the carrier for scr
Industry News | 2010-08-23 14:30:41.0
CyberOptics Corporation (NASDAQ: CYBE) will feature its award winning AOI and SPI In-Line inspection Systems at GlobalTRONICS 2010 scheduled to take place from September 13 - 15, 2010 at Sands Expo and Convention Centre, Hall A in Singapore.
Industry News | 2013-09-10 13:21:08.0
Koh Young will exhibit new SPI and AOI measurement technology at the upcoming SMTAI conference and exhibition in Fort Worth, Texas, in Booth #136
Industry News | 2014-08-26 17:42:46.0
Akrometrix LLC will exhibit in Booth #541 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2017-08-02 07:12:18.0
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
Used SMT Equipment | AOI / Automated Optical Inspection
SAKY BF-PLANET-X With a superior resolution of 10μm and scanning line color CCD camera, both AOI system provide accurate and stable inspection results. Solder fillets on components as small as the high density mounted 01005(0402) chip, as well a
Used SMT Equipment | SPI / Solder Paste Inspection
TRI TR7007 3D Solder Paste Inspection Technology, SPI, Year 2011 Test Research Inc. (TRI) Dynamic imaging offers an improved solution for 3D SPI in term of accuracy, speed and field of view (FOV). The main advantage of dynamic imaging is that inspe
Used SMT Equipment | SPI / Solder Paste Inspection
All the machines have been maintained by the manufacturer or the official distributor in accordance with required maintenance schedule. ASK QUOTATION! Dimensions Unit Height 139 cm (55 in.) excluding signal-light pole and leveling feet Unit Wi
