Electronics Forum | Wed Aug 19 08:00:55 EDT 1998 | Earl Moon
| Hi there, | I'm actually facing a lot of trouble with PCB's presenting up to 3mm of bow /twist at reception i.e. before assembly. The PCB size is 220 by 230mm. The boards are to be assembeled SMD double sides with 05.mm pitch on both sides. In orde
Electronics Forum | Wed Apr 21 00:35:31 EDT 1999 | Scott Cook
| Netters, | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | 1. Kester 293 no clean | 2. 2.1 C/s for 30s to 150 C | 3. .5 - .7 C/s for 60s to 185
Industry News | 2013-12-18 15:18:53.0
Isola Group had successfully transitioned the manufacturing of its low-loss, I-Speed material to Asia. The move was in response to an increased demand for I-Speed products. The cost benefits of manufacturing in Asia have enabled a price reduction of I-Speed for printed circuit board (PCB) fabricators located in the Asia-Pacific region.
Technical Library | 2024-09-02 17:01:54.0
A printed circuit board (PCB) is an integral component of any electronic product and is among the most challenging components to recycle. While PCB manufacturing processes undergo generations of innovation and advancement with 21st century technologies, the recycling of PCBs primarily employs 1920's shredding and separation technologies. There is a critical need for alternative PCB recycling routes to satisfy the increasing environmental demands. Previous work has developed an environmentally benign supercritical fluid process that successfully delaminated the PCB substrates and separated the PCB layers. While this work was successful in delamination of the PCB substrates, further understanding is needed to maximize the interactions between the supercritical fluid and PCB for an optimal processing scenario. As such, this research presents an exploratory study to further investigate the supercritical fluid PCB recycling process by using supercritical carbon dioxide and an additional amount of water to delaminate PCB substrates. The focus of this study is to test delamination success at low temperature and pressure supercritical conditions in comparison to the previous studies. Furthermore, material characterization methods, such as differential scanning calorimetry, dynamic mechanical analysis, and Fourier transform infrared spectroscopy, are included to study the delaminating mechanisms. Results from the recycling process testing showed that the PCB substrates delaminated easily and could be further separated into copper foils, glass fibers and polymers. Surprisingly, the material characterization suggested that there were no significant changes in glass transition temperature, crosslink density, and FTIR spectra of the PCBs before and after the supercritical fluid process.
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_determine-hole-size-for-plastic-peg-alignment-pins_topic720.xml
;Do you know if a large difference of the glass transition temperature or Tg value between the MiniDIMM socket and the PCB matter for reliable reflow soldering
| http://etasmt.com/cc?ID=te_news_bulletin,24964&url=_print
PCB enters a glass-transition phase that causes it to sag in the center. The higher the temperature, the greater the sag and
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