Electronics Forum | Thu Aug 09 19:13:37 EDT 2007 | htran
DaveF, Our customer requirement is to comply with IPC-STD-001 but the J std doesn't specify the bake out temperature for populated boards and the moisture absortion rate. Right now we are baking the populated PWAs after aqueous wash at 80C at 18-48
Electronics Forum | Thu Jun 04 14:30:13 EDT 1998 | Igmar
I would appreciate any information concerning the wash and bake of blank Printed Circuit Boards before assembly. + Is it necessary to wash and bake PCB�s before assembly? + If any, what is the reason for wash and bake of PCB�s? + If any, what type of
Electronics Forum | Thu Feb 12 16:50:40 EST 1998 | Igmar
I would appreciate any information concerning the wash and bake of blank Printed Circuit Boards before assembly. + Is it necessary to wash and bake PCB�s before assembly? + If any, what is the reason for wash and bake of PCB�s? + If any, what type of
Electronics Forum | Thu Feb 12 17:21:07 EST 1998 | Justin Medernach
| I would appreciate any information concerning the wash and bake of blank Printed Circuit Boards | before assembly. | + Is it necessary to wash and bake PCB�s before assembly? | + If any, what is the reason for wash and bake of PCB�s? | + If any, wh
Electronics Forum | Fri Aug 06 10:07:50 EDT 2004 | blnorman
OSP has limited elevated temperature exposure capability. Couple that with the fact that solvents (IPA in particular) will remove the OSP. The more material you loose the higher the chances for pad oxidation. We ran an experiment with board washin
Electronics Forum | Fri Jun 26 00:28:43 EDT 2009 | Mark
IPA is hydroscopic.
Electronics Forum | Tue Jun 30 13:20:10 EDT 2009 | charliedci
He wants to "see underwater"
Electronics Forum | Thu Jun 11 22:57:45 EDT 2009 | davef
NASA recommends baking a PCB for a minimum of 4 hours at 93+/- 5.5�C before conformally coating. [NASA-STD-8739.1, �Workmanship Standard for Staking and Conformal Coating of Printed Wiring Boards and Electronic Assemblies,� August 6, 1999]
Electronics Forum | Wed Jun 24 05:08:37 EDT 2009 | Mark
Try immersing the assembly in IPA for 30 minutes. IPA is hydroscopic ans will drive off most of the water. Dry the assembly. Then bake at 110°C for 2 hours.
Electronics Forum | Wed Jun 10 22:47:17 EDT 2009 | davef
You're correct that JEDEC J-STD-033 defines baking condidtions for moisture sensitive components. Why do you want to bake assemblies after cleaning? Search the fine SMTnet Archives for threads like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Me
