Full Site - : wash bake (Page 2 of 16)

Wash and bake of blank PCB's before assembly

Electronics Forum | Thu Feb 12 16:50:40 EST 1998 | Igmar

I would appreciate any information concerning the wash and bake of blank Printed Circuit Boards before assembly. + Is it necessary to wash and bake PCB�s before assembly? + If any, what is the reason for wash and bake of PCB�s? + If any, what type of

Re: Wash and bake of blank PCB's before assembly

Electronics Forum | Thu Feb 12 17:21:07 EST 1998 | Justin Medernach

| I would appreciate any information concerning the wash and bake of blank Printed Circuit Boards | before assembly. | + Is it necessary to wash and bake PCB�s before assembly? | + If any, what is the reason for wash and bake of PCB�s? | + If any, wh

If we could bake the Board with OSP finish?

Electronics Forum | Fri Aug 06 10:07:50 EDT 2004 | blnorman

OSP has limited elevated temperature exposure capability. Couple that with the fact that solvents (IPA in particular) will remove the OSP. The more material you loose the higher the chances for pad oxidation. We ran an experiment with board washin

Baking assemblies after ultrasonic water wash

Electronics Forum | Fri Jun 26 00:28:43 EDT 2009 | Mark

IPA is hydroscopic.

Baking assemblies after ultrasonic water wash

Electronics Forum | Tue Jun 30 13:20:10 EDT 2009 | charliedci

He wants to "see underwater"

Baking assemblies after ultrasonic water wash

Electronics Forum | Thu Jun 11 22:57:45 EDT 2009 | davef

NASA recommends baking a PCB for a minimum of 4 hours at 93+/- 5.5�C before conformally coating. [NASA-STD-8739.1, �Workmanship Standard for Staking and Conformal Coating of Printed Wiring Boards and Electronic Assemblies,� August 6, 1999]

Baking assemblies after ultrasonic water wash

Electronics Forum | Wed Jun 24 05:08:37 EDT 2009 | Mark

Try immersing the assembly in IPA for 30 minutes. IPA is hydroscopic ans will drive off most of the water. Dry the assembly. Then bake at 110°C for 2 hours.

Baking assemblies after ultrasonic water wash

Electronics Forum | Wed Jun 10 22:47:17 EDT 2009 | davef

You're correct that JEDEC J-STD-033 defines baking condidtions for moisture sensitive components. Why do you want to bake assemblies after cleaning? Search the fine SMTnet Archives for threads like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Me

Baking assemblies after ultrasonic water wash

Electronics Forum | Thu Jun 25 20:01:54 EDT 2009 | davef

Shanelo Technologies Given that isopropyl alcohol [IPA] is produced by combining water and propene. How does soaking a board in water and a flammable liquid drive off water?

Baking assemblies after ultrasonic water wash

Electronics Forum | Wed Jul 01 05:26:31 EDT 2009 | kpm135

But the boards and parts on the boards are also hygroscopic(no not a typo I did a search on hydroscopic and it is not a word the actual word is hygroscopic look it up if you don't believe me) so if you have two hygroscopic materials which one wins?


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