Electronics Forum | Tue Jun 09 18:44:20 EDT 2009 | dyoungquist
We are using a water soluble flux which requires the assemblies to be cleaned in an ultra sonic cleaner after assembly. Is there a standard that specifies how long the assemblies need to be baked/dried after being submersed in a water solution for a
Electronics Forum | Thu Jun 11 10:02:36 EDT 2009 | dyoungquist
Our cleaning process involves the assemblies being completely immersed in the water bath of the ultrasonic cleaner. The assembly has a QFP44 on it. Customer stated that when these assemblies have been cleaned with water in the past (at a different
Electronics Forum | Thu Mar 25 09:27:08 EDT 2010 | stepheniii
Thanks I guess I got used to google where the "and" is implied. I searched various combinations and all I could find were threads regarding the pcb's not the components. Does anyone bake their boards after wash before second reflow because of MSD c
Electronics Forum | Mon Jan 30 16:30:55 EST 2006 | GS
Hi James, it could be the problem is due to residual of cleaner media entrapped under low gap of QFP 208 and 0,5 mm lead pitch. I remember in the past we had random problems of failure at test after board wash off process (DI Water wash). We met
Electronics Forum | Wed Mar 24 16:54:38 EDT 2010 | stepheniii
J-STD-033B.1 Says "For cavity packages in which water may be entrpped, water clean processes after first reflow can be an additional source of moisture. This may present an additional risk, which should be evaluated." And it talks about derating if
Electronics Forum | Thu Nov 01 17:36:20 EST 2001 | davef
We don�t bake between routine washing between soldering cycles. We bake when we immediately go to test or box-build. Certainly, it all depends on your process, materials, and boards. So, how did you determine that you needed to spend the money? I
Electronics Forum | Fri Aug 16 09:59:49 EDT 2002 | dason_c
We baked the board first and print 2 mil water soluble paste at the BGA location and reflow. Wash and baked before the production run.
Electronics Forum | Mon Dec 01 14:51:55 EST 2014 | jpal
We had the same problem too. Water would remain under the caps even after a bake out. We saw this numerous times when the caps were removed after the wash and bake. The only fix was to hand solder the large electrolytics.
Electronics Forum | Thu Nov 01 01:48:14 EST 2001 | hamos_wks
168hrs, 1week of storage and frequently applied for rework after testing.
Electronics Forum | Wed Dec 03 08:39:09 EST 2008 | sys_steven
boards are polyimide, and it is an ipa rinse with the solvent cleaner.
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